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Chan, Kah-Yoong, Teo, Bee-San (2005) Sputtering power and deposition pressure effects on the electrical and structural properties of copper thin films. Journal of Materials Science, 40. 5971-5981 doi:10.1007/s10853-005-1362-8

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Reference TypeJournal (article/letter/editorial)
TitleSputtering power and deposition pressure effects on the electrical and structural properties of copper thin films
JournalJournal of Materials Science
AuthorsChan, Kah-YoongAuthor
Teo, Bee-SanAuthor
Year2005 (November)Volume40
PublisherSpringer Science and Business Media LLC
DOIdoi:10.1007/s10853-005-1362-8Search in ResearchGate
Generate Citation Formats
Mindat Ref. ID10003413Long-form Identifiermindat:1:5:10003413:8
GUID0
Full ReferenceChan, Kah-Yoong, Teo, Bee-San (2005) Sputtering power and deposition pressure effects on the electrical and structural properties of copper thin films. Journal of Materials Science, 40. 5971-5981 doi:10.1007/s10853-005-1362-8
Plain TextChan, Kah-Yoong, Teo, Bee-San (2005) Sputtering power and deposition pressure effects on the electrical and structural properties of copper thin films. Journal of Materials Science, 40. 5971-5981 doi:10.1007/s10853-005-1362-8
In(n.d.) Journal of Materials Science Vol. 40. Springer Science and Business Media LLC

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Chan, Kah-Yoong, Luo, Pei-Qing, Zhou, Zhi-Bin, Tou, Teck-Yong, Teo, Bee-San (2009) Influence of direct current plasma magnetron sputtering parameters on the material characteristics of polycrystalline copper films. Applied Surface Science, 255. 5186-5190 doi:10.1016/j.apsusc.2008.09.072
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MÁRQUEZ-HERRERA, A., ZAPATA-NAVARRO, A., DE LA PAZ CRUZ-JÁUREGUI, MA. (2005) Ferroelectric properties of barium titanate thin films grown on nichrome substrates by RF sputtering. Journal of Materials Science, 40. 5103-5105 doi:10.1007/s10853-005-1706-4
II Park, Chan, Kim, Nam-Hoon (2018) Dependence of Structural, Compositional, Electrical, and Optical Properties of Sputtering-Deposited CdS Thin Films on Laser-Annealing Power. Science of Advanced Materials, 10. 232-237 doi:10.1166/sam.2018.2959
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