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Tseng, Chien-Fu, Duh, Jenq-Gong (2013) The influence of Pd on growth behavior of a quaternary (Cu,Ni,Pd)6Sn5 compound in Sn–3.0Ag–0.5Cu/Au/Pd/Ni–P solder joint during a liquid state reaction. Journal of Materials Science, 48. 857-865 doi:10.1007/s10853-012-6807-2

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Reference TypeJournal (article/letter/editorial)
TitleThe influence of Pd on growth behavior of a quaternary (Cu,Ni,Pd)6Sn5 compound in Sn–3.0Ag–0.5Cu/Au/Pd/Ni–P solder joint during a liquid state reaction
JournalJournal of Materials Science
AuthorsTseng, Chien-FuAuthor
Duh, Jenq-GongAuthor
Year2013 (January)Volume48
PublisherSpringer Science and Business Media LLC
DOIdoi:10.1007/s10853-012-6807-2Search in ResearchGate
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Mindat Ref. ID10011650Long-form Identifiermindat:1:5:10011650:6
GUID0
Full ReferenceTseng, Chien-Fu, Duh, Jenq-Gong (2013) The influence of Pd on growth behavior of a quaternary (Cu,Ni,Pd)6Sn5 compound in Sn–3.0Ag–0.5Cu/Au/Pd/Ni–P solder joint during a liquid state reaction. Journal of Materials Science, 48. 857-865 doi:10.1007/s10853-012-6807-2
Plain TextTseng, Chien-Fu, Duh, Jenq-Gong (2013) The influence of Pd on growth behavior of a quaternary (Cu,Ni,Pd)6Sn5 compound in Sn–3.0Ag–0.5Cu/Au/Pd/Ni–P solder joint during a liquid state reaction. Journal of Materials Science, 48. 857-865 doi:10.1007/s10853-012-6807-2
In(n.d.) Journal of Materials Science Vol. 48. Springer Science and Business Media LLC

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Tseng, Chien-Fu, Ho, Cheng-Ying, Lee, Joseph, Duh, Jenq-Gong (2014) Crystallographic characterization and growth behavior of (Cu,Ni,Pd)6Sn5 intermetallic compound in Ni(P)/Pd/Au/SnAgCu/Cu assembled solder joint. Journal of Alloys and Compounds, 600. 21-28 doi:10.1016/j.jallcom.2014.02.054
Tseng, Chien-Fu, Duh, Jenq-Gong (2013) Correlation between microstructure evolution and mechanical strength in the Sn–3.0Ag–0.5Cu/ENEPIG solder joint. Materials Science and Engineering: A, 580. 169-174 doi:10.1016/j.msea.2013.05.058
Chen, Wei-Yu, Yu, Chi-Yang, Duh, Jenq-Gong (2012) Suppressing the growth of interfacial Cu–Sn intermetallic compounds in the Sn–3.0Ag–0.5Cu–0.1Ni/Cu–15Zn solder joint during thermal aging. Journal of Materials Science, 47. 4012-4018 doi:10.1007/s10853-012-6254-0
Ho, Cheng-Ying, Duh, Jenq-Gong (2013) Wetting kinetics and wettability enhancement of Pd added electrolytic Ni surface with molten Sn–3.0Ag–0.5Cu solder. Materials Letters, 92. 278-280 doi:10.1016/j.matlet.2012.10.063
Tseng, Chien-Fu, Lee, Tae-Kyu, Ramakrishna, Gnyaneshwar, Liu, Kuo-Chuan, Duh, Jenq-Gong (2011) Suppressing Ni3Sn4 formation in the Sn–Ag–Cu solder joints with Ni–P/Pd/Au surface finish. Materials Letters, 65. 3216-3218 doi:10.1016/j.matlet.2011.07.015
Ho, Cheng-Ying, Duh, Jenq-Gong, Lin, Chih-Wei, Lin, Chun-Jen, Wu, Yu-Hui, Hong, Huei-Cheng, Wang, Te-Hui (2013) Microstructural variation and high-speed impact responses of Sn–3.0Ag–0.5Cu/ENEPIG solder joints with ultra-thin Ni–P deposit. Journal of Materials Science, 48. 2724-2732 doi:10.1007/s10853-012-7070-2
Kim, Jungsoo, Jung, Seung-Boo, Yoon, Jeong-Won (2020) Effects of crystalline and amorphous Pd layers on initial interfacial reactions at Sn-3.0Ag-0.5Cu/thin-Au/Pd/Ni(P) solder joints. Applied Surface Science, 503. 144339pp. doi:10.1016/j.apsusc.2019.144339
Kim, Jungsoo, Jung, Seung-Boo, Yoon, Jeong-Won (2021) Effect of Ni(P) thickness in Au/Pd/Ni(P) surface finish on the electrical reliability of Sn–3.0Ag–0.5Cu solder joints during current-stressing. Journal of Alloys and Compounds, 850. 156729pp. doi:10.1016/j.jallcom.2020.156729
Yu, Chi-Yang, Duh, Jenq-Gong (2012) Growth mechanisms of interfacial intermetallic compounds in Sn/Cu–Zn solder joints during aging. Journal of Materials Science, 47. 6467-6474 doi:10.1007/s10853-012-6581-1
Wu, Yi-Hsin, Yu, Chi-Yang, Ho, Cheng-Ying, Duh, Jenq-Gong (2013) Retardation of (Cu,Ni)6Sn5 spalling in Sn–Ag–Cu/Ni solder joints via controlling the grain structure of Ni metallization layer. Materials Letters, 105. 40-42 doi:10.1016/j.matlet.2013.04.059
Fu, Shao-Wei, Yu, Chi-Yang, Lee, Tae-Kyu, Liu, Kuo-Chuan, Duh, Jenq-Gong (2012) Impact crack propagation through the dual-phased (Cu,Ni)6Sn5 layer in Sn–Ag–Cu/Ni solder joints. Materials Letters, 80. 103-105 doi:10.1016/j.matlet.2012.04.099
 
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