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Raghavan, R., Harzer, T. P., Djaziri, S., Hieke, S. W., Kirchlechner, C., Dehm, G. (2017) Maintaining strength in supersaturated copper–chromium thin films annealed at 0.5 of the melting temperature of Cu. Journal of Materials Science, 52. 913-920 doi:10.1007/s10853-016-0386-6

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Reference TypeJournal (article/letter/editorial)
TitleMaintaining strength in supersaturated copper–chromium thin films annealed at 0.5 of the melting temperature of Cu
JournalJournal of Materials Science
AuthorsRaghavan, R.Author
Harzer, T. P.Author
Djaziri, S.Author
Hieke, S. W.Author
Kirchlechner, C.Author
Dehm, G.Author
Year2017 (January)Volume52
PublisherSpringer Science and Business Media LLC
DOIdoi:10.1007/s10853-016-0386-6Search in ResearchGate
Generate Citation Formats
Mindat Ref. ID10015384Long-form Identifiermindat:1:5:10015384:6
GUID0
Full ReferenceRaghavan, R., Harzer, T. P., Djaziri, S., Hieke, S. W., Kirchlechner, C., Dehm, G. (2017) Maintaining strength in supersaturated copper–chromium thin films annealed at 0.5 of the melting temperature of Cu. Journal of Materials Science, 52. 913-920 doi:10.1007/s10853-016-0386-6
Plain TextRaghavan, R., Harzer, T. P., Djaziri, S., Hieke, S. W., Kirchlechner, C., Dehm, G. (2017) Maintaining strength in supersaturated copper–chromium thin films annealed at 0.5 of the melting temperature of Cu. Journal of Materials Science, 52. 913-920 doi:10.1007/s10853-016-0386-6
In(n.d.) Journal of Materials Science Vol. 52. Springer Science and Business Media LLC

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