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Fan, X.G., Yang, H., Sun, Z.C., Zhang, D.W. (2010) Quantitative analysis of dynamic recrystallization behavior using a grain boundary evolution based kinetic model. Materials Science and Engineering: A, 527. 5368-5377 doi:10.1016/j.msea.2010.05.032

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Reference TypeJournal (article/letter/editorial)
TitleQuantitative analysis of dynamic recrystallization behavior using a grain boundary evolution based kinetic model
JournalMaterials Science and Engineering: A
AuthorsFan, X.G.Author
Yang, H.Author
Sun, Z.C.Author
Zhang, D.W.Author
Year2010 (August)Volume527
PublisherElsevier BV
DOIdoi:10.1016/j.msea.2010.05.032Search in ResearchGate
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Mindat Ref. ID10040263Long-form Identifiermindat:1:5:10040263:0
GUID0
Full ReferenceFan, X.G., Yang, H., Sun, Z.C., Zhang, D.W. (2010) Quantitative analysis of dynamic recrystallization behavior using a grain boundary evolution based kinetic model. Materials Science and Engineering: A, 527. 5368-5377 doi:10.1016/j.msea.2010.05.032
Plain TextFan, X.G., Yang, H., Sun, Z.C., Zhang, D.W. (2010) Quantitative analysis of dynamic recrystallization behavior using a grain boundary evolution based kinetic model. Materials Science and Engineering: A, 527. 5368-5377 doi:10.1016/j.msea.2010.05.032
In(n.d.) Materials Science and Engineering: A Vol. 527. Elsevier BV

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