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Chandler, H.D. (2010) A comparison between steady state creep and stress relaxation in copper. Materials Science and Engineering: A, 527. 6219-6223 doi:10.1016/j.msea.2010.06.018

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Reference TypeJournal (article/letter/editorial)
TitleA comparison between steady state creep and stress relaxation in copper
JournalMaterials Science and Engineering: A
AuthorsChandler, H.D.Author
Year2010 (September)Volume527
PublisherElsevier BV
DOIdoi:10.1016/j.msea.2010.06.018Search in ResearchGate
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Mindat Ref. ID10040354Long-form Identifiermindat:1:5:10040354:5
GUID0
Full ReferenceChandler, H.D. (2010) A comparison between steady state creep and stress relaxation in copper. Materials Science and Engineering: A, 527. 6219-6223 doi:10.1016/j.msea.2010.06.018
Plain TextChandler, H.D. (2010) A comparison between steady state creep and stress relaxation in copper. Materials Science and Engineering: A, 527. 6219-6223 doi:10.1016/j.msea.2010.06.018
In(n.d.) Materials Science and Engineering: A Vol. 527. Elsevier BV

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Chandler, H.D. (1993) Creep of copper in the temperature range 423–623 K. Materials Science and Engineering: A, 169. 27-32 doi:10.1016/0921-5093(93)90595-6
Liu, Po, Zong, Yingying, Shan, Debin, Guo, Bin (2015) Relationship between constant-load creep, decreasing-load creep and stress relaxation of titanium alloy. Materials Science and Engineering: A, 638. 106-113 doi:10.1016/j.msea.2015.04.054
Whittaker, M.T., Wilshire, B. (2010) Creep and creep fracture of 2.25Cr–1.6W steels (Grade 23). Materials Science and Engineering: A, 527. 4932-4938 doi:10.1016/j.msea.2010.04.033
Gollapudi, S., Rajulapati, K.V., Charit, I., Koch, C.C., Scattergood, R.O., Murty, K.L. (2010) Creep in nanocrystalline materials: Role of stress assisted grain growth. Materials Science and Engineering: A, 527. 5773-5781 doi:10.1016/j.msea.2010.05.048
 
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