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Chan, W.L., Fu, M.W., Lu, J., Liu, J.G. (2010) Modeling of grain size effect on micro deformation behavior in micro-forming of pure copper. Materials Science and Engineering: A, 527. 6638-6648 doi:10.1016/j.msea.2010.07.009

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Reference TypeJournal (article/letter/editorial)
TitleModeling of grain size effect on micro deformation behavior in micro-forming of pure copper
JournalMaterials Science and Engineering: A
AuthorsChan, W.L.Author
Fu, M.W.Author
Lu, J.Author
Liu, J.G.Author
Year2010 (September)Volume527
PublisherElsevier BV
DOIdoi:10.1016/j.msea.2010.07.009Search in ResearchGate
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Mindat Ref. ID10040425Long-form Identifiermindat:1:5:10040425:2
GUID0
Full ReferenceChan, W.L., Fu, M.W., Lu, J., Liu, J.G. (2010) Modeling of grain size effect on micro deformation behavior in micro-forming of pure copper. Materials Science and Engineering: A, 527. 6638-6648 doi:10.1016/j.msea.2010.07.009
Plain TextChan, W.L., Fu, M.W., Lu, J., Liu, J.G. (2010) Modeling of grain size effect on micro deformation behavior in micro-forming of pure copper. Materials Science and Engineering: A, 527. 6638-6648 doi:10.1016/j.msea.2010.07.009
In(n.d.) Materials Science and Engineering: A Vol. 527. Elsevier BV

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