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Caris, Joshua, Li, Dingqiang, Stephens, John J., Lewandowski, John J. (2010) Microstructural effects on tension behavior of Cu–15Ni–8Sn sheet. Materials Science and Engineering: A, 527. 769-781 doi:10.1016/j.msea.2009.08.049

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Reference TypeJournal (article/letter/editorial)
TitleMicrostructural effects on tension behavior of Cu–15Ni–8Sn sheet
JournalMaterials Science and Engineering: A
AuthorsCaris, JoshuaAuthor
Li, DingqiangAuthor
Stephens, John J.Author
Lewandowski, John J.Author
Year2010 (January)Volume527
PublisherElsevier BV
DOIdoi:10.1016/j.msea.2009.08.049Search in ResearchGate
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Mindat Ref. ID10040641Long-form Identifiermindat:1:5:10040641:6
GUID0
Full ReferenceCaris, Joshua, Li, Dingqiang, Stephens, John J., Lewandowski, John J. (2010) Microstructural effects on tension behavior of Cu–15Ni–8Sn sheet. Materials Science and Engineering: A, 527. 769-781 doi:10.1016/j.msea.2009.08.049
Plain TextCaris, Joshua, Li, Dingqiang, Stephens, John J., Lewandowski, John J. (2010) Microstructural effects on tension behavior of Cu–15Ni–8Sn sheet. Materials Science and Engineering: A, 527. 769-781 doi:10.1016/j.msea.2009.08.049
In(n.d.) Materials Science and Engineering: A Vol. 527. Elsevier BV

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