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Yan, Yabin, Sumigawa, Takashi, Kitamura, Takayuki (2012) Effect of environment on fatigue strength of Cu/Si interface in nanoscale components. Materials Science and Engineering: A, 556. 147-154 doi:10.1016/j.msea.2012.06.070

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Reference TypeJournal (article/letter/editorial)
TitleEffect of environment on fatigue strength of Cu/Si interface in nanoscale components
JournalMaterials Science and Engineering: A
AuthorsYan, YabinAuthor
Sumigawa, TakashiAuthor
Kitamura, TakayukiAuthor
Year2012 (October)Volume556
PublisherElsevier BV
DOIdoi:10.1016/j.msea.2012.06.070Search in ResearchGate
Generate Citation Formats
Mindat Ref. ID10043355Long-form Identifiermindat:1:5:10043355:9
GUID0
Full ReferenceYan, Yabin, Sumigawa, Takashi, Kitamura, Takayuki (2012) Effect of environment on fatigue strength of Cu/Si interface in nanoscale components. Materials Science and Engineering: A, 556. 147-154 doi:10.1016/j.msea.2012.06.070
Plain TextYan, Yabin, Sumigawa, Takashi, Kitamura, Takayuki (2012) Effect of environment on fatigue strength of Cu/Si interface in nanoscale components. Materials Science and Engineering: A, 556. 147-154 doi:10.1016/j.msea.2012.06.070
In(n.d.) Materials Science and Engineering: A Vol. 556. Elsevier BV

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Sumigawa, Takashi, Kitamura, Takayuki, Murakami, Tadashi (2011) Fatigue strength of the Cu/Si interface in nano-components. Materials Science and Engineering: A, 528. 5158-5163 doi:10.1016/j.msea.2011.03.023
Sumigawa, Takashi, Murakami, Tadashi, Shishido, Tetsuya, Kitamura, Takayuki (2010) Cu/Si interface fracture due to fatigue of copper film in nanometer scale. Materials Science and Engineering: A, 527. 6518-6523 doi:10.1016/j.msea.2010.07.002
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Sumigawa, Takashi, Matsumoto, Kenta, Tsuchiya, Toshiyuki, Kitamura, Takayuki (2012) Fatigue of 1μm-scale gold by vibration with reduced resonant frequency. Materials Science and Engineering: A, 556. 429-436 doi:10.1016/j.msea.2012.07.009
Fang, Hui, Shiohara, Ryosuke, Sumigawa, Takashi, Kitamura, Takayuki (2014) Size dependence of fatigue damage in sub-micrometer single crystal gold. Materials Science and Engineering: A, 618. 416-423 doi:10.1016/j.msea.2014.09.017
Huang, Kai, Sumigawa, Takashi, Kitamura, Takayuki (2021) Experimental evaluation of loading mode effect on plasticity of microscale single-crystal copper. Materials Science and Engineering: A, 806. 140822pp. doi:10.1016/j.msea.2021.140822
Sumigawa, Takashi, Shishido, Tetsuya, Murakami, Tadashi, Kitamura, Takayuki (2010) Interface crack initiation due to nano-scale stress concentration. Materials Science and Engineering: A, 527. 4796-4803 doi:10.1016/j.msea.2010.04.002
Sumigawa, Takashi, Matsumoto, Kenta, Kitamura, Takayuki (2014) Effect of Microscopic Structure on High-Cycle Fatigue Behavior in Nano-Components. Advanced Materials Research, 891. 1705-1710 doi:10.4028/www.scientific.net/amr.891-892.1705
Sumigawa, Takashi, Matsumoto, Kenta, Fang, Hui, Kitamura, Takayuki (2014) Formation of slip bands in poly-crystalline nano-copper under high-cycle fatigue of fully-reversed loading. Materials Science and Engineering: A, 608. 221-228 doi:10.1016/j.msea.2014.04.085
Guo, Licheng, Kitamura, Takayuki, Yan, Yabin, Sumigawa, Takashi, Huang, Kai (2015) Fracture mechanics investigation on crack propagation in the nano-multilayered materials. International Journal of Solids and Structures, 64. 208-220 doi:10.1016/j.ijsolstr.2015.03.025
Sumigawa, Takashi, Uegaki, Shin, Yukishita, Tetsuya, Arai, Shigeo, Takahashi, Yoshimasa, Kitamura, Takayuki (2019) FE-SEM in situ observation of damage evolution in tension-compression fatigue of micro-sized single-crystal copper. Materials Science and Engineering: A, 764. 138218pp. doi:10.1016/j.msea.2019.138218
 
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