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Tsao, L.C., Cheng, S.Y., Chen, C.W., Chen, Ting-Yu (2016) Effect of nano-TiO2 particles and cooling rate on the thermal, microstructure and mechanical properties of novel low-ag Sn1.5Sb1Ag solders. Materials Science and Engineering: A, 658. 159-166 doi:10.1016/j.msea.2016.01.115

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Reference TypeJournal (article/letter/editorial)
TitleEffect of nano-TiO2 particles and cooling rate on the thermal, microstructure and mechanical properties of novel low-ag Sn1.5Sb1Ag solders
JournalMaterials Science and Engineering: A
AuthorsTsao, L.C.Author
Cheng, S.Y.Author
Chen, C.W.Author
Chen, Ting-YuAuthor
Year2016 (March)Volume658
PublisherElsevier BV
DOIdoi:10.1016/j.msea.2016.01.115Search in ResearchGate
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Mindat Ref. ID10048280Long-form Identifiermindat:1:5:10048280:9
GUID0
Full ReferenceTsao, L.C., Cheng, S.Y., Chen, C.W., Chen, Ting-Yu (2016) Effect of nano-TiO2 particles and cooling rate on the thermal, microstructure and mechanical properties of novel low-ag Sn1.5Sb1Ag solders. Materials Science and Engineering: A, 658. 159-166 doi:10.1016/j.msea.2016.01.115
Plain TextTsao, L.C., Cheng, S.Y., Chen, C.W., Chen, Ting-Yu (2016) Effect of nano-TiO2 particles and cooling rate on the thermal, microstructure and mechanical properties of novel low-ag Sn1.5Sb1Ag solders. Materials Science and Engineering: A, 658. 159-166 doi:10.1016/j.msea.2016.01.115
In(n.d.) Materials Science and Engineering: A Vol. 658. Elsevier BV

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