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Wang, Shaobin, Yao, Yao, Long, Xu (2019) Critical Review of Size Effects on Microstructure and Mechanical Properties of Solder Joints for Electronic Packaging. Applied Sciences, 9. 227pp. doi:10.3390/app9020227

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Reference TypeJournal (article/letter/editorial)
TitleCritical Review of Size Effects on Microstructure and Mechanical Properties of Solder Joints for Electronic Packaging
JournalApplied Sciences
AuthorsWang, ShaobinAuthor
Yao, YaoAuthor
Long, XuAuthor
Year2019 (January 10)Volume9
PublisherMDPI AG
DOIdoi:10.3390/app9020227Search in ResearchGate
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Mindat Ref. ID10100144Long-form Identifiermindat:1:5:10100144:3
GUID0
Full ReferenceWang, Shaobin, Yao, Yao, Long, Xu (2019) Critical Review of Size Effects on Microstructure and Mechanical Properties of Solder Joints for Electronic Packaging. Applied Sciences, 9. 227pp. doi:10.3390/app9020227
Plain TextWang, Shaobin, Yao, Yao, Long, Xu (2019) Critical Review of Size Effects on Microstructure and Mechanical Properties of Solder Joints for Electronic Packaging. Applied Sciences, 9. 227pp. doi:10.3390/app9020227
In(n.d.) Applied Sciences Vol. 9. MDPI AG

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