Reference Type | Journal (article/letter/editorial) |
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Title | Numerical Study of Heat Transfer Enhancement in Microchannels of the MTPV Systems |
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Journal | Applied Mechanics and Materials |
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Authors | Wu, Ge Ping | Author |
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Lu, Ping | Author |
Year | 2013 (April) | Volume | 316 |
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Publisher | Trans Tech Publications, Ltd. |
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DOI | doi:10.4028/www.scientific.net/amm.316-317.119Search in ResearchGate |
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| Generate Citation Formats |
Mindat Ref. ID | 11802292 | Long-form Identifier | mindat:1:5:11802292:9 |
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GUID | 0 |
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Full Reference | Wu, Ge Ping, Lu, Ping (2013) Numerical Study of Heat Transfer Enhancement in Microchannels of the MTPV Systems. Applied Mechanics and Materials, 316. 119-123 doi:10.4028/www.scientific.net/amm.316-317.119 |
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Plain Text | Wu, Ge Ping, Lu, Ping (2013) Numerical Study of Heat Transfer Enhancement in Microchannels of the MTPV Systems. Applied Mechanics and Materials, 316. 119-123 doi:10.4028/www.scientific.net/amm.316-317.119 |
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In | (n.d.) Applied Mechanics and Materials Vol. 316. Trans Tech Publications, Ltd. |
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