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Yagi, S., Ichitsubo, T., Matsubara, E., Yamaguchi, M., Kimura, H., Sasamori, K. (2009) Interfacial reaction of gas-atomized Sn–Zn solder containing Ni and Cu additives. Journal of Alloys and Compounds, 484. 185-189 doi:10.1016/j.jallcom.2009.05.088

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Reference TypeJournal (article/letter/editorial)
TitleInterfacial reaction of gas-atomized Sn–Zn solder containing Ni and Cu additives
JournalJournal of Alloys and Compounds
AuthorsYagi, S.Author
Ichitsubo, T.Author
Matsubara, E.Author
Yamaguchi, M.Author
Kimura, H.Author
Sasamori, K.Author
Year2009 (September)Volume484
PublisherElsevier BV
DOIdoi:10.1016/j.jallcom.2009.05.088Search in ResearchGate
Generate Citation Formats
Mindat Ref. ID11894162Long-form Identifiermindat:1:5:11894162:6
GUID0
Full ReferenceYagi, S., Ichitsubo, T., Matsubara, E., Yamaguchi, M., Kimura, H., Sasamori, K. (2009) Interfacial reaction of gas-atomized Sn–Zn solder containing Ni and Cu additives. Journal of Alloys and Compounds, 484. 185-189 doi:10.1016/j.jallcom.2009.05.088
Plain TextYagi, S., Ichitsubo, T., Matsubara, E., Yamaguchi, M., Kimura, H., Sasamori, K. (2009) Interfacial reaction of gas-atomized Sn–Zn solder containing Ni and Cu additives. Journal of Alloys and Compounds, 484. 185-189 doi:10.1016/j.jallcom.2009.05.088
In(n.d.) Journal of Alloys and Compounds Vol. 484. Elsevier BV

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Yamaguchi, Masahiko, Ichitsubo, Tetsu, Matsubara, Eiichiro, Kimura, Hisamichi, Sasamori, Kenichiro, Irie, Hisao, Kumamoto, Seishi, Anada, Takaaki (2006) Atomizing Effect on Sn-Zn Based Solder Alloy. Journal of the Japan Institute of Metals, 70 (2). 162-165 doi:10.2320/jinstmet.70.162
Ichitsubo, Tetsu, Matsubara, Eiichiro, Fujiwara, Kozo, Yamaguchi, Masahiko, Irie, Hisao, Kumamoto, Seishi, Anada, Takaaki (2005) Control of compound forming reaction at the interface between SnZn solder and Cu substrate. Journal of Alloys and Compounds, 392. 200-205 doi:10.1016/j.jallcom.2004.09.043
Islam, M.N., Chan, Y.C., Rizvi, M.J., Jillek, W. (2005) Investigations of interfacial reactions of Sn–Zn based and Sn–Ag–Cu lead-free solder alloys as replacement for Sn–Pb solder. Journal of Alloys and Compounds, 400. 136-144 doi:10.1016/j.jallcom.2005.03.053
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Sharif, Ahmed, Chan, Y.C. (2007) Investigation of interfacial reactions between Sn–Zn solder with electrolytic Ni and electroless Ni(P) metallization. Journal of Alloys and Compounds, 440. 117-121 doi:10.1016/j.jallcom.2006.09.020
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Shen, J., Chan, Y.C. (2009) Effects of ZrO2 nanoparticles on the mechanical properties of Sn–Zn solder joints on Au/Ni/Cu pads. Journal of Alloys and Compounds, 477. 552-559 doi:10.1016/j.jallcom.2008.10.140
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