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Yuan, Y., Borzone, G., Zanicchi, G., Delsante, S. (2011) Lead-free soldering: Investigation of the Cu–Sn–Sb system along the Sn:Sb=1:1 isopleth. Journal of Alloys and Compounds, 509. 1595-1600 doi:10.1016/j.jallcom.2010.10.186

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Reference TypeJournal (article/letter/editorial)
TitleLead-free soldering: Investigation of the Cu–Sn–Sb system along the Sn:Sb=1:1 isopleth
JournalJournal of Alloys and Compounds
AuthorsYuan, Y.Author
Borzone, G.Author
Zanicchi, G.Author
Delsante, S.Author
Year2011 (February)Volume509
PublisherElsevier BV
DOIdoi:10.1016/j.jallcom.2010.10.186Search in ResearchGate
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Mindat Ref. ID11899265Long-form Identifiermindat:1:5:11899265:9
GUID0
Full ReferenceYuan, Y., Borzone, G., Zanicchi, G., Delsante, S. (2011) Lead-free soldering: Investigation of the Cu–Sn–Sb system along the Sn:Sb=1:1 isopleth. Journal of Alloys and Compounds, 509. 1595-1600 doi:10.1016/j.jallcom.2010.10.186
Plain TextYuan, Y., Borzone, G., Zanicchi, G., Delsante, S. (2011) Lead-free soldering: Investigation of the Cu–Sn–Sb system along the Sn:Sb=1:1 isopleth. Journal of Alloys and Compounds, 509. 1595-1600 doi:10.1016/j.jallcom.2010.10.186
In(n.d.) Journal of Alloys and Compounds Vol. 509. Elsevier BV

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Amore, S., Delsante, S., Parodi, N., Borzone, G. (2008) Calorimetric investigation of the Cu-Sn-Bi lead-free solder system. Journal of Thermal Analysis and Calorimetry, 92 (1) 227-232 doi:10.1007/s10973-007-8814-0
Yuan, Y., Delsante, S., Yi, J., Borzone, G. (2010) A revision of the Sm-rich region of the Sm–Co system. Journal of Alloys and Compounds, 508. 309-314 doi:10.1016/j.jallcom.2010.08.035
Giuranno, Donatella, Delsante, Simona, Borzone, Gabriella, Novakovic, Rada (2016) Effects of Sb addition on the properties of Sn-Ag-Cu/(Cu, Ni) solder systems. Journal of Alloys and Compounds, 689. 918-930 doi:10.1016/j.jallcom.2016.08.035
Novakovic, R., Giuranno, D., Ricci, E., Delsante, S., Li, D., Borzone, G. (2011) Bulk and surface properties of liquid Sb–Sn alloys. Surface Science, 605 (1). 248-255 doi:10.1016/j.susc.2010.10.026
Mookam, Niwat, Kanlayasiri, Kannachai (2011) Effect of soldering condition on formation of intermetallic phases developed between Sn–0.3Ag–0.7Cu low-silver lead-free solder and Cu substrate. Journal of Alloys and Compounds, 509. 6276-6279 doi:10.1016/j.jallcom.2011.03.049
Borzone, G., Delsante, S., Li, D., Novakovic, R. (2021) New Insights into Phase Equilibria of the Sb-Sn System. Journal of Phase Equilibria and Diffusion, 42 (1) 63-76 doi:10.1007/s11669-020-00849-7
Lapsa, J., Onderka, B., Schmetterer, C., Ipser, H., Yuan, Y., Borzone, G. (2011) Liquidus determination in the Cu–Sb–Sn ternary system. Thermochimica Acta, 519. 55-58 doi:10.1016/j.tca.2011.02.032
Novakovic, R., Lanata, T., Delsante, S., Borzone, G. (2012) Interfacial reactions in the Sb–Sn/(Cu, Ni) systems: Wetting experiments. Materials Chemistry and Physics, 137. 458-465 doi:10.1016/j.matchemphys.2012.09.028
Delsante, S., Ghosh, G., Borzone, G. (2009) A calorimetric study of alloys along the Ti(Zn, Al)3 section. Calphad, 33 (1) 50-54 doi:10.1016/j.calphad.2008.08.003
Frongia, F., Pilloni, M., Scano, A., Ardu, A., Cannas, C., Musinu, A., Borzone, G., Delsante, S., Novakovic, R., Ennas, G. (2015) Synthesis and melting behaviour of Bi, Sn and Sn–Bi nanostructured alloy. Journal of Alloys and Compounds, 623. 7-14 doi:10.1016/j.jallcom.2014.08.122
Tsao, L.C. (2011) Evolution of nano-Ag3Sn particle formation on Cu–Sn intermetallic compounds of Sn3.5Ag0.5Cu composite solder/Cu during soldering. Journal of Alloys and Compounds, 509. 2326-2333 doi:10.1016/j.jallcom.2010.11.010
 
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