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Yu, Chi-Yang, Chen, Wei-Yu, Duh, Jenq-Gong (2014) Improving the impact toughness of Sn–Ag–Cu/Cu–Zn Pb-free solder joints under high speed shear testing. Journal of Alloys and Compounds, 586. 633-638 doi:10.1016/j.jallcom.2013.10.113

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Reference TypeJournal (article/letter/editorial)
TitleImproving the impact toughness of Sn–Ag–Cu/Cu–Zn Pb-free solder joints under high speed shear testing
JournalJournal of Alloys and Compounds
AuthorsYu, Chi-YangAuthor
Chen, Wei-YuAuthor
Duh, Jenq-GongAuthor
Year2014 (February)Volume586
PublisherElsevier BV
DOIdoi:10.1016/j.jallcom.2013.10.113Search in ResearchGate
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Mindat Ref. ID11904486Long-form Identifiermindat:1:5:11904486:9
GUID0
Full ReferenceYu, Chi-Yang, Chen, Wei-Yu, Duh, Jenq-Gong (2014) Improving the impact toughness of Sn–Ag–Cu/Cu–Zn Pb-free solder joints under high speed shear testing. Journal of Alloys and Compounds, 586. 633-638 doi:10.1016/j.jallcom.2013.10.113
Plain TextYu, Chi-Yang, Chen, Wei-Yu, Duh, Jenq-Gong (2014) Improving the impact toughness of Sn–Ag–Cu/Cu–Zn Pb-free solder joints under high speed shear testing. Journal of Alloys and Compounds, 586. 633-638 doi:10.1016/j.jallcom.2013.10.113
In(n.d.) Journal of Alloys and Compounds Vol. 586. Elsevier BV

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Chen, Wei-Yu, Yu, Chi-Yang, Duh, Jenq-Gong (2014) Improving the shear strength of Sn–Ag–Cu–Ni/Cu–Zn solder joints via modifying the microstructure and phase stability of Cu–Sn intermetallic compounds. Intermetallics, 54. 181-186 doi:10.1016/j.intermet.2014.05.023
Yu, Chi-Yang, Chen, Wei-Yu, Duh, Jenq-Gong (2012) Suppressing the growth of Cu–Sn intermetallic compounds in Ni/Sn–Ag–Cu/Cu–Zn solder joints during thermal aging. Intermetallics, 26. 11-17 doi:10.1016/j.intermet.2012.03.046
Yu, Chi-Yang, Lee, Joseph, Chen, Wen-Lin, Duh, Jenq-Gong (2014) Enhancement of the impact toughness in Sn–Ag–Cu/Cu solder joints via modifying the microstructure of solder alloy. Materials Letters, 119. 20-23 doi:10.1016/j.matlet.2013.12.088
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Fu, Shao-Wei, Yu, Chi-Yang, Lee, Tae-Kyu, Liu, Kuo-Chuan, Duh, Jenq-Gong (2012) Impact crack propagation through the dual-phased (Cu,Ni)6Sn5 layer in Sn–Ag–Cu/Ni solder joints. Materials Letters, 80. 103-105 doi:10.1016/j.matlet.2012.04.099
Yu, Chi-Yang, Duh, Jenq-Gong (2012) Growth mechanisms of interfacial intermetallic compounds in Sn/Cu–Zn solder joints during aging. Journal of Materials Science, 47. 6467-6474 doi:10.1007/s10853-012-6581-1
Chen, Wen-Lin, Yu, Chi-Yang, Ho, Cheng-Ying, Duh, Jenq-Gong (2014) Effects of thermal annealing in the post-reflow process on microstructure, tin crystallography, and impact reliability of Sn–Ag–Cu solder joints. Materials Science and Engineering: A, 613. 193-200 doi:10.1016/j.msea.2014.06.102
Chen, Wei-Yu, Yu, Chi-Yang, Duh, Jenq-Gong (2012) Suppressing the growth of interfacial Cu–Sn intermetallic compounds in the Sn–3.0Ag–0.5Cu–0.1Ni/Cu–15Zn solder joint during thermal aging. Journal of Materials Science, 47. 4012-4018 doi:10.1007/s10853-012-6254-0
Wu, Yi-Hsin, Yu, Chi-Yang, Ho, Cheng-Ying, Duh, Jenq-Gong (2013) Retardation of (Cu,Ni)6Sn5 spalling in Sn–Ag–Cu/Ni solder joints via controlling the grain structure of Ni metallization layer. Materials Letters, 105. 40-42 doi:10.1016/j.matlet.2013.04.059
Miao, Hui-Wei, Duh, Jenq-Gong (2001) Microstructure evolution in Sn–Bi and Sn–Bi–Cu solder joints under thermal aging. Materials Chemistry and Physics, 71. 255-271 doi:10.1016/s0254-0584(01)00298-x
Tsai, Yi-Da, Yu, Chi-Yang, Hu, Chi-Chang, Duh, Jenq-Gong (2011) Pulse Electroplating of Sn-Bi Alloys on Micropatterned Electrodes for Lead-Free Solder Bumping. Journal of the Electrochemical Society, 159. doi:10.1149/2.083202jes
 
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