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El-Daly, A.A., El-Taher, A.M., Dalloul, T.R. (2014) Improved creep resistance and thermal behavior of Ni-doped Sn–3.0Ag–0.5Cu lead-free solder. Journal of Alloys and Compounds, 587. 32-39 doi:10.1016/j.jallcom.2013.10.148

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Reference TypeJournal (article/letter/editorial)
TitleImproved creep resistance and thermal behavior of Ni-doped Sn–3.0Ag–0.5Cu lead-free solder
JournalJournal of Alloys and Compounds
AuthorsEl-Daly, A.A.Author
El-Taher, A.M.Author
Dalloul, T.R.Author
Year2014 (February)Volume587
PublisherElsevier BV
DOIdoi:10.1016/j.jallcom.2013.10.148Search in ResearchGate
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Mindat Ref. ID11904544Long-form Identifiermindat:1:5:11904544:6
GUID0
Full ReferenceEl-Daly, A.A., El-Taher, A.M., Dalloul, T.R. (2014) Improved creep resistance and thermal behavior of Ni-doped Sn–3.0Ag–0.5Cu lead-free solder. Journal of Alloys and Compounds, 587. 32-39 doi:10.1016/j.jallcom.2013.10.148
Plain TextEl-Daly, A.A., El-Taher, A.M., Dalloul, T.R. (2014) Improved creep resistance and thermal behavior of Ni-doped Sn–3.0Ag–0.5Cu lead-free solder. Journal of Alloys and Compounds, 587. 32-39 doi:10.1016/j.jallcom.2013.10.148
In(n.d.) Journal of Alloys and Compounds Vol. 587. Elsevier BV

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El-Daly, A.A., Hammad, A.E. (2010) Elastic properties and thermal behavior of Sn–Zn based lead-free solder alloys. Journal of Alloys and Compounds, 505. 793-800 doi:10.1016/j.jallcom.2010.06.142
El-Daly, A.A., Swilem, Y., Makled, M.H., El-Shaarawy, M.G., Abdraboh, A.M. (2009) Thermal and mechanical properties of Sn–Zn–Bi lead-free solder alloys. Journal of Alloys and Compounds, 484. 134-142 doi:10.1016/j.jallcom.2009.04.108
El-Daly, A.A., Swilem, Y., Hammad, A.E. (2009) Creep properties of Sn–Sb based lead-free solder alloys. Journal of Alloys and Compounds, 471. 98-104 doi:10.1016/j.jallcom.2008.03.097
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El-Daly, A.A., Eid, N.A.M., Ibrahiem, A.A. (2022) Synergic effect of Te, Ni and MWCNT on creep behavior and microstructural evolution of Sn-1.0Ag-0.7Cu low-Ag solder. Journal of Alloys and Compounds, 902. 163808pp. doi:10.1016/j.jallcom.2022.163808
El-Daly, A.A., Fawzy, A., Mohamad, A.Z., El-Taher, A.M. (2011) Microstructural evolution and tensile properties of Sn–5Sb solder alloy containing small amount of Ag and Cu. Journal of Alloys and Compounds, 509. 4574-4582 doi:10.1016/j.jallcom.2011.01.109
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Tu, Xiaoxuan, Yi, Danqing, Wu, Jing, Wang, Bin (2017) Influence of Ce addition on Sn-3.0Ag-0.5Cu solder joints: Thermal behavior, microstructure and mechanical properties. Journal of Alloys and Compounds, 698. 317-328 doi:10.1016/j.jallcom.2016.12.191
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