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Luo, Jie Si, Zhang, Ying Jie, Liu, Zi Lian, Xiao, Hui, Guo, Xiao Tong, Xu, Huan Xiang (2021) Failure Analysis and Evaluation of Material Compatibility of Solder Paste. Materials Science Forum, 1033. 109-115 doi:10.4028/www.scientific.net/msf.1033.109

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Reference TypeJournal (article/letter/editorial)
TitleFailure Analysis and Evaluation of Material Compatibility of Solder Paste
JournalMaterials Science Forum
AuthorsLuo, Jie SiAuthor
Zhang, Ying JieAuthor
Liu, Zi LianAuthor
Xiao, HuiAuthor
Guo, Xiao TongAuthor
Xu, Huan XiangAuthor
Year2021 (June)Volume1033
PublisherTrans Tech Publications, Ltd.
DOIdoi:10.4028/www.scientific.net/msf.1033.109Search in ResearchGate
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Mindat Ref. ID13231736Long-form Identifiermindat:1:5:13231736:0
GUID0
Full ReferenceLuo, Jie Si, Zhang, Ying Jie, Liu, Zi Lian, Xiao, Hui, Guo, Xiao Tong, Xu, Huan Xiang (2021) Failure Analysis and Evaluation of Material Compatibility of Solder Paste. Materials Science Forum, 1033. 109-115 doi:10.4028/www.scientific.net/msf.1033.109
Plain TextLuo, Jie Si, Zhang, Ying Jie, Liu, Zi Lian, Xiao, Hui, Guo, Xiao Tong, Xu, Huan Xiang (2021) Failure Analysis and Evaluation of Material Compatibility of Solder Paste. Materials Science Forum, 1033. 109-115 doi:10.4028/www.scientific.net/msf.1033.109
In(2021) Materials Science Forum Vol. 1033. Trans Tech Publications, Ltd.

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