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Wang, Wen Yi, Hui, Kwok Tung, Kan, Chi Wai, Visesphan, Krailerck, Areechongchareon, Saowanee, Tiyasri, Somporn, Mongkholrattanasit, Rattanaphol (2020) A Study of Thermal Conductivity Property of Socks. Materials Science Forum, 1007. 118-124 doi:10.4028/www.scientific.net/msf.1007.118

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Reference TypeJournal (article/letter/editorial)
TitleA Study of Thermal Conductivity Property of Socks
JournalMaterials Science Forum
AuthorsWang, Wen YiAuthor
Hui, Kwok TungAuthor
Kan, Chi WaiAuthor
Visesphan, KrailerckAuthor
Areechongchareon, SaowaneeAuthor
Tiyasri, SompornAuthor
Mongkholrattanasit, RattanapholAuthor
Year2020 (August)Volume1007
PublisherTrans Tech Publications, Ltd.
DOIdoi:10.4028/www.scientific.net/msf.1007.118Search in ResearchGate
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Mindat Ref. ID13232912Long-form Identifiermindat:1:5:13232912:7
GUID0
Full ReferenceWang, Wen Yi, Hui, Kwok Tung, Kan, Chi Wai, Visesphan, Krailerck, Areechongchareon, Saowanee, Tiyasri, Somporn, Mongkholrattanasit, Rattanaphol (2020) A Study of Thermal Conductivity Property of Socks. Materials Science Forum, 1007. 118-124 doi:10.4028/www.scientific.net/msf.1007.118
Plain TextWang, Wen Yi, Hui, Kwok Tung, Kan, Chi Wai, Visesphan, Krailerck, Areechongchareon, Saowanee, Tiyasri, Somporn, Mongkholrattanasit, Rattanaphol (2020) A Study of Thermal Conductivity Property of Socks. Materials Science Forum, 1007. 118-124 doi:10.4028/www.scientific.net/msf.1007.118
In(2020) Materials Science Forum Vol. 1007. Trans Tech Publications, Ltd.

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