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Liu, Yuling, Chen, Chong, Liu, Dandan, Du, Yong, Liu, Shuhong, Tao, Xiaoma, Ouyang, Yifang (2017) Diffusivities and atomic mobilities for fcc Cu–Ni–Sn alloys. Calphad, 59. 84-89 doi:10.1016/j.calphad.2017.08.005

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Reference TypeJournal (article/letter/editorial)
TitleDiffusivities and atomic mobilities for fcc Cu–Ni–Sn alloys
JournalCalphad
AuthorsLiu, YulingAuthor
Chen, ChongAuthor
Liu, DandanAuthor
Du, YongAuthor
Liu, ShuhongAuthor
Tao, XiaomaAuthor
Ouyang, YifangAuthor
Year2017 (December)Volume59
PublisherElsevier BV
DOIdoi:10.1016/j.calphad.2017.08.005Search in ResearchGate
Generate Citation Formats
Mindat Ref. ID14975051Long-form Identifiermindat:1:5:14975051:8
GUID0
Full ReferenceLiu, Yuling, Chen, Chong, Liu, Dandan, Du, Yong, Liu, Shuhong, Tao, Xiaoma, Ouyang, Yifang (2017) Diffusivities and atomic mobilities for fcc Cu–Ni–Sn alloys. Calphad, 59. 84-89 doi:10.1016/j.calphad.2017.08.005
Plain TextLiu, Yuling, Chen, Chong, Liu, Dandan, Du, Yong, Liu, Shuhong, Tao, Xiaoma, Ouyang, Yifang (2017) Diffusivities and atomic mobilities for fcc Cu–Ni–Sn alloys. Calphad, 59. 84-89 doi:10.1016/j.calphad.2017.08.005
In(2017) Calphad Vol. 59. Elsevier BV

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