Kim, Dong-Won, Um, Ki-Youn, Kim, Heung-Gu, Lee, In-Seon, Kim, Sang-Ho, Park, Jong-Soo, Ryi, Shin-Kun, Cho, Sung-Ho (2005) A Pd-Cu-Ni Ternary Alloyed Membrane on Porous Nickel Support Prepared by Sputtering and Copper Reflow. Japanese Journal of Applied Physics, 44. doi:10.1143/jjap.44.l233
Reference Type | Journal (article/letter/editorial) | ||
---|---|---|---|
Title | A Pd-Cu-Ni Ternary Alloyed Membrane on Porous Nickel Support Prepared by Sputtering and Copper Reflow | ||
Journal | Japanese Journal of Applied Physics | ||
Authors | Kim, Dong-Won | Author | |
Um, Ki-Youn | Author | ||
Kim, Heung-Gu | Author | ||
Lee, In-Seon | Author | ||
Kim, Sang-Ho | Author | ||
Park, Jong-Soo | Author | ||
Ryi, Shin-Kun | Author | ||
Cho, Sung-Ho | Author | ||
Year | 2005 (January 28) | Volume | 44 |
Publisher | Japan Society of Applied Physics | ||
DOI | doi:10.1143/jjap.44.l233Search in ResearchGate | ||
Generate Citation Formats | |||
Mindat Ref. ID | 15024306 | Long-form Identifier | mindat:1:5:15024306:1 |
GUID | 0 | ||
Full Reference | Kim, Dong-Won, Um, Ki-Youn, Kim, Heung-Gu, Lee, In-Seon, Kim, Sang-Ho, Park, Jong-Soo, Ryi, Shin-Kun, Cho, Sung-Ho (2005) A Pd-Cu-Ni Ternary Alloyed Membrane on Porous Nickel Support Prepared by Sputtering and Copper Reflow. Japanese Journal of Applied Physics, 44. doi:10.1143/jjap.44.l233 | ||
Plain Text | Kim, Dong-Won, Um, Ki-Youn, Kim, Heung-Gu, Lee, In-Seon, Kim, Sang-Ho, Park, Jong-Soo, Ryi, Shin-Kun, Cho, Sung-Ho (2005) A Pd-Cu-Ni Ternary Alloyed Membrane on Porous Nickel Support Prepared by Sputtering and Copper Reflow. Japanese Journal of Applied Physics, 44. doi:10.1143/jjap.44.l233 | ||
In | (2005) Japanese Journal of Applied Physics Vol. 44. Japan Society of Applied Physics |
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