Ooka, Masahiro, Yokoyama, Shin (2006) Effect of H2Addition during Cu Thin-Film Sputtering. Japanese Journal of Applied Physics, 45 (12) 9058-9062 doi:10.1143/jjap.45.9058
Reference Type | Journal (article/letter/editorial) | ||
---|---|---|---|
Title | Effect of H2Addition during Cu Thin-Film Sputtering | ||
Journal | Japanese Journal of Applied Physics | ||
Authors | Ooka, Masahiro | Author | |
Yokoyama, Shin | Author | ||
Year | 2006 (December 7) | Volume | 45 |
Issue | 12 | ||
Publisher | Japan Society of Applied Physics | ||
DOI | doi:10.1143/jjap.45.9058Search in ResearchGate | ||
Generate Citation Formats | |||
Mindat Ref. ID | 15027311 | Long-form Identifier | mindat:1:5:15027311:2 |
GUID | 0 | ||
Full Reference | Ooka, Masahiro, Yokoyama, Shin (2006) Effect of H2Addition during Cu Thin-Film Sputtering. Japanese Journal of Applied Physics, 45 (12) 9058-9062 doi:10.1143/jjap.45.9058 | ||
Plain Text | Ooka, Masahiro, Yokoyama, Shin (2006) Effect of H2Addition during Cu Thin-Film Sputtering. Japanese Journal of Applied Physics, 45 (12) 9058-9062 doi:10.1143/jjap.45.9058 | ||
In | (2006, December) Japanese Journal of Applied Physics Vol. 45 (12) Japan Society of Applied Physics |
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