Mukai, Kohki, Kitayama, Shinya, Yoshimura, Toshiya, Maruo, Shoji (2008) Ferrite and Copper Electroless Plating of Photopolymerized Resin for Micromolding of Three-Dimensional Structures. Japanese Journal of Applied Physics, 47 (4) 3232-3235 doi:10.1143/jjap.47.3232
Reference Type | Journal (article/letter/editorial) | ||
---|---|---|---|
Title | Ferrite and Copper Electroless Plating of Photopolymerized Resin for Micromolding of Three-Dimensional Structures | ||
Journal | Japanese Journal of Applied Physics | ||
Authors | Mukai, Kohki | Author | |
Kitayama, Shinya | Author | ||
Yoshimura, Toshiya | Author | ||
Maruo, Shoji | Author | ||
Year | 2008 (April 25) | Volume | 47 |
Issue | 4 | ||
Publisher | Japan Society of Applied Physics | ||
DOI | doi:10.1143/jjap.47.3232Search in ResearchGate | ||
Generate Citation Formats | |||
Mindat Ref. ID | 15031908 | Long-form Identifier | mindat:1:5:15031908:7 |
GUID | 0 | ||
Full Reference | Mukai, Kohki, Kitayama, Shinya, Yoshimura, Toshiya, Maruo, Shoji (2008) Ferrite and Copper Electroless Plating of Photopolymerized Resin for Micromolding of Three-Dimensional Structures. Japanese Journal of Applied Physics, 47 (4) 3232-3235 doi:10.1143/jjap.47.3232 | ||
Plain Text | Mukai, Kohki, Kitayama, Shinya, Yoshimura, Toshiya, Maruo, Shoji (2008) Ferrite and Copper Electroless Plating of Photopolymerized Resin for Micromolding of Three-Dimensional Structures. Japanese Journal of Applied Physics, 47 (4) 3232-3235 doi:10.1143/jjap.47.3232 | ||
In | (2008, April) Japanese Journal of Applied Physics Vol. 47 (4) Japan Society of Applied Physics |
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