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Wu, You-Lin, Huang, Chiung-Yi, Liang, Cheng-Hsun (2009) Improvement in the Cumulative Failure Distribution of High-kDielectric Subjected to Nanoscale Stress by D2Post-Deposition Annealing. Japanese Journal of Applied Physics, 48 (11) 111403 doi:10.1143/jjap.48.111403

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Reference TypeJournal (article/letter/editorial)
TitleImprovement in the Cumulative Failure Distribution of High-kDielectric Subjected to Nanoscale Stress by D2Post-Deposition Annealing
JournalJapanese Journal of Applied Physics
AuthorsWu, You-LinAuthor
Huang, Chiung-YiAuthor
Liang, Cheng-HsunAuthor
Year2009 (November 20)Volume48
Issue11
PublisherJapan Society of Applied Physics
DOIdoi:10.1143/jjap.48.111403Search in ResearchGate
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Mindat Ref. ID15033058Long-form Identifiermindat:1:5:15033058:7
GUID0
Full ReferenceWu, You-Lin, Huang, Chiung-Yi, Liang, Cheng-Hsun (2009) Improvement in the Cumulative Failure Distribution of High-kDielectric Subjected to Nanoscale Stress by D2Post-Deposition Annealing. Japanese Journal of Applied Physics, 48 (11) 111403 doi:10.1143/jjap.48.111403
Plain TextWu, You-Lin, Huang, Chiung-Yi, Liang, Cheng-Hsun (2009) Improvement in the Cumulative Failure Distribution of High-kDielectric Subjected to Nanoscale Stress by D2Post-Deposition Annealing. Japanese Journal of Applied Physics, 48 (11) 111403 doi:10.1143/jjap.48.111403
In(2009, November) Japanese Journal of Applied Physics Vol. 48 (11) Japan Society of Applied Physics


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