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Yamazaki, Tsutomu, Doi, Toshiro K., Uneda, Michio, Kurokawa, Syuhei, Ohnishi, Osamu, Seshimo, Kiyoshi, Aida, Hideo (2012) Effect of Groove Pattern of Chemical Mechanical Polishing Pad on Slurry Flow Behavior. Japanese Journal of Applied Physics, 51. 5 doi:10.1143/jjap.51.05ef03

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Reference TypeJournal (article/letter/editorial)
TitleEffect of Groove Pattern of Chemical Mechanical Polishing Pad on Slurry Flow Behavior
JournalJapanese Journal of Applied Physics
AuthorsYamazaki, TsutomuAuthor
Doi, Toshiro K.Author
Uneda, MichioAuthor
Kurokawa, SyuheiAuthor
Ohnishi, OsamuAuthor
Seshimo, KiyoshiAuthor
Aida, HideoAuthor
Year2012 (May 21)Volume51
PublisherJapan Society of Applied Physics
DOIdoi:10.1143/jjap.51.05ef03Search in ResearchGate
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Mindat Ref. ID15040318Long-form Identifiermindat:1:5:15040318:2
GUID0
Full ReferenceYamazaki, Tsutomu, Doi, Toshiro K., Uneda, Michio, Kurokawa, Syuhei, Ohnishi, Osamu, Seshimo, Kiyoshi, Aida, Hideo (2012) Effect of Groove Pattern of Chemical Mechanical Polishing Pad on Slurry Flow Behavior. Japanese Journal of Applied Physics, 51. 5 doi:10.1143/jjap.51.05ef03
Plain TextYamazaki, Tsutomu, Doi, Toshiro K., Uneda, Michio, Kurokawa, Syuhei, Ohnishi, Osamu, Seshimo, Kiyoshi, Aida, Hideo (2012) Effect of Groove Pattern of Chemical Mechanical Polishing Pad on Slurry Flow Behavior. Japanese Journal of Applied Physics, 51. 5 doi:10.1143/jjap.51.05ef03
In(2012) Japanese Journal of Applied Physics Vol. 51. Japan Society of Applied Physics

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Yamazaki, Tsutomu, Doi, Toshiro K., Uneda, Michio, Kurokawa, Syuhei, Ohnishi, Osamu, Seshimo, Kiyoshi, Aida, Hideo (2012) Effect of Groove Pattern of Chemical Mechanical Polishing Pad on Slurry Flow Behavior. Japanese Journal of Applied Physics, 51 (5) 5 doi:10.7567/jjap.51.05ef03
Yamazaki, Tsutomu, Doi, Toshiro K., Kurokawa, Syuhei, Ohnishi, Osamu, Uneda, Michio, Seshimo, Kiyoshi, Aida, Hideo (2012) Development of Novel Groove Patterns for CMP Pad. Advanced Materials Research, 497. 264-267 doi:10.4028/www.scientific.net/amr.497.264
Ohnishi, Osamu, Doi, Toshiro, Kurokawa, Syuhei, Yamazaki, Tsutomu, Uneda, Michio, Yin, Tao, Koshiyama, Isamu, Ichikawa, Koichiro, Aida, Hideo (2012) Effects of Atmosphere and Ultraviolet Light Irradiation on Chemical Mechanical Polishing Characteristics of SiC Wafers. Japanese Journal of Applied Physics, 51. 5 doi:10.1143/jjap.51.05ef05
Ohnishi, Osamu, Doi, Toshiro, Kurokawa, Syuhei, Yamazaki, Tsutomu, Uneda, Michio, Yin, Tao, Koshiyama, Isamu, Ichikawa, Koichiro, Aida, Hideo (2012) Effects of Atmosphere and Ultraviolet Light Irradiation on Chemical Mechanical Polishing Characteristics of SiC Wafers. Japanese Journal of Applied Physics, 51 (5) 5 doi:10.7567/jjap.51.05ef05
Uneda, Michio, Omote, Tatsunori, Ishikawa, Ken-ichi, Ichikawa, Koichiro, Doi, Toshiro, Kurokawa, Syuhei, Ohnishi, Osamu (2012) Performance Evaluation Method of Chemical Mechanical Polishing Pad Conditioner Using Digital Image Correlation Processing. Japanese Journal of Applied Physics, 51. 5 doi:10.1143/jjap.51.05ef02
Uneda, Michio, Omote, Tatsunori, Ishikawa, Ken-ichi, Ichikawa, Koichiro, Doi, Toshiro, Kurokawa, Syuhei, Ohnishi, Osamu (2012) Performance Evaluation Method of Chemical Mechanical Polishing Pad Conditioner Using Digital Image Correlation Processing. Japanese Journal of Applied Physics, 51 (5) 5 doi:10.7567/jjap.51.05ef02
Ikeda, Hiroshi, Akagami, Yoichi, Uneda, Michio, Ohnishi, Osamu, Kurokawa, Syuhei, Doi, Toshiro K. (2012) The Polishing Technology for Glass Substrates Using Tribo-Chemical Reaction and Electrical Slurry Control. Journal of the Electrochemical Society, 159. doi:10.1149/2.063204jes
Yamada, Yohei, Kawakubo, Masanori, Hirai, Osamu, Konishi, Nobuhiro, Kurokawa, Syuhei, Doi, Toshiro (2008) Frictional Characterization of Chemical–Mechanical Polishing Pad Surface and Diamond Conditioner Wear. Japanese Journal of Applied Physics, 47 (8) 6282-6287 doi:10.1143/jjap.47.6282
Fukuda, Akira, Kodera, Akira, Toma, Yasushi, Suzuki, Tsukuru, Hiyama, Hirokuni, Doi, Toshiro, Kurokawa, Syuhei, Ohnishi, Osamu (2010) Removal Rate Simulation of Dissolution-Type Electrochemical Mechanical Polishing. Japanese Journal of Applied Physics, 49 (7) 76701 doi:10.1143/jjap.49.076701
Wang, Cheng Wu, Kurokawa, Syuhei, Doi, Toshiro, Sano, Yasuhisa, Aida, Hideo, Ohnishi, Osamu, Uneda, Michio, Ohyama, Koki, Hayashi, Terutake, Zhang, Ji, Eiji, Asakawa (2015) Consideration of Femtosecond Laser-Induced Effect on Semiconductor Material SiC Substrate for CMP Processing. Applied Mechanics and Materials, 799. 458-462 doi:10.4028/www.scientific.net/amm.799-800.458
Sano, Yasuhisa, Doi, Toshiro, Kurokawa, Syuhei, Aida, Hideo, Ohnishi, Osamu, Uneda, Michio, Okada, Yuu, Nishikawa, Hiroaki, Yamauchi, Kazuto (2014) Basic Study on Etching Selectivity of Plasma Chemical Vaporization Machining by Introducing Crystallographic Damage into Work Surface. Key Engineering Materials, 625. 550-553 doi:10.4028/www.scientific.net/kem.625.550
 
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