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Kim, Jeong-Kyu, Cheon, Tae-Hoon, Kim, Soo-Hyun, Park, Young-Bae (2012) Interfacial Adhesion Energy of Ru–AlO Thin Film Deposited by Atomic Layer Deposition between Cu and SiO2: Effect of the Composition of Ru–AlO Thin Film. Japanese Journal of Applied Physics, 51 (5) 5 doi:10.7567/jjap.51.05eb04

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Reference TypeJournal (article/letter/editorial)
TitleInterfacial Adhesion Energy of Ru–AlO Thin Film Deposited by Atomic Layer Deposition between Cu and SiO2: Effect of the Composition of Ru–AlO Thin Film
JournalJapanese Journal of Applied Physics
AuthorsKim, Jeong-KyuAuthor
Cheon, Tae-HoonAuthor
Kim, Soo-HyunAuthor
Park, Young-BaeAuthor
Year2012 (May 1)Volume51
Issue5
PublisherJapan Society of Applied Physics
DOIdoi:10.7567/jjap.51.05eb04Search in ResearchGate
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Mindat Ref. ID15042693Long-form Identifiermindat:1:5:15042693:8
GUID0
Full ReferenceKim, Jeong-Kyu, Cheon, Tae-Hoon, Kim, Soo-Hyun, Park, Young-Bae (2012) Interfacial Adhesion Energy of Ru–AlO Thin Film Deposited by Atomic Layer Deposition between Cu and SiO2: Effect of the Composition of Ru–AlO Thin Film. Japanese Journal of Applied Physics, 51 (5) 5 doi:10.7567/jjap.51.05eb04
Plain TextKim, Jeong-Kyu, Cheon, Tae-Hoon, Kim, Soo-Hyun, Park, Young-Bae (2012) Interfacial Adhesion Energy of Ru–AlO Thin Film Deposited by Atomic Layer Deposition between Cu and SiO2: Effect of the Composition of Ru–AlO Thin Film. Japanese Journal of Applied Physics, 51 (5) 5 doi:10.7567/jjap.51.05eb04
In(2012, May) Japanese Journal of Applied Physics Vol. 51 (5) Japan Society of Applied Physics

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Kim, Jeong-Kyu, Cheon, Tae-Hoon, Kim, Soo-Hyun, Park, Young-Bae (2012) Interfacial Adhesion Energy of Ru–AlO Thin Film Deposited by Atomic Layer Deposition between Cu and SiO$_{2}$: Effect of the Composition of Ru–AlO Thin Film. Japanese Journal of Applied Physics, 51. 5 doi:10.1143/jjap.51.05eb04
Hong, Tae Eun, Cheon, Taehoon, Kim, Soo-Hyun, Kim, Jeong-Kyu, Park, Young-Bae, Kwon, Oh Joong, Kim, Myung Jun, Kim, Jae Jeong (2013) Effects of AlOx incorporation into atomic layer deposited Ru thin films: Applications to Cu direct plating technology. Journal of Alloys and Compounds, 580. 72-81 doi:10.1016/j.jallcom.2013.05.035
Son, Kirak, Kim, Gahui, Jeong, Daeyoon, Kim, Soo-Hyun, Park, Young-Bae (2025) Effects of the TiN diffusion barrier and post‑annealing between Ru and SiO2 films on the interfacial adhesion energy for advanced interconnections. Japanese Journal of Applied Physics, 64 (3). doi:10.35848/1347-4065/adba68
Jeong, Tae Hoon, Kim, Si Joon, Yoon, Doo Hyun, Jeong, Woong Hee, Kim, Dong Lim, Lim, Hyun Soo, Kim, Hyun Jae (2011) Study on the Effects of Zr-Incorporated InZnO Thin-Film Transistors Using a Solution Process. Japanese Journal of Applied Physics, 50 (7) 70202 doi:10.7567/jjap.50.070202
Kweon, Minjeong; Park, Chaehyun; Mohapatra, Debananda; Kim, Sang Bok; Bae, Jong-Seong; Cheon, Taehoon; Kim, Soo-Hyun (2025) Yttrium carbide thin film as an emerging transition metal carbide Prepared by plasma-enhanced atomic layer deposition for Dual diffusion barrier applications into Cu and Ru metallization. Applied Surface Science, 701. doi:10.1016/j.apsusc.2025.163302
Han, Jeong In, Kim, Yong-Hoon, Park, Sung Kyu (2012) Enhanced Stability of All Solution-Processed Organic Thin-Film Transistors Using Highly Conductive Modified Polymer Electrodes. Japanese Journal of Applied Physics, 51 (9) 91602 doi:10.7567/jjap.51.091602
Jeong, Tae Hoon, Kim, Si Joon, Yoon, Doo Hyun, Jeong, Woong Hee, Kim, Dong Lim, Lim, Hyun Soo, Kim, Hyun Jae (2011) Study on the Effects of Zr-Incorporated InZnO Thin-Film Transistors Using a Solution Process. Japanese Journal of Applied Physics, 50 (7) 70202 doi:10.1143/jjap.50.070202
Sari, Windu, Eom, Tae-Kwang, Choi, Sang-Hyeok, Kim, Soo-Hyun (2011) Ru/WNxBilayers as Diffusion Barriers for Cu Interconnects. Japanese Journal of Applied Physics, 50 (5) 5 doi:10.7567/jjap.50.05ea08
Kim, Jae-Myeong, Jeong, Myeong-Hyeok, Yoo, Sehoon, Park, Young-Bae (2012) Effect of Interfacial Microstructures on the Bonding Strength of Sn–3.0Ag–0.5Cu Pb-Free Solder Bump. Japanese Journal of Applied Physics, 51 (5) 5 doi:10.7567/jjap.51.05ee06
Park, Jong-Myeong, Kim, Seung-Hyun, Jeong, Myeong-Hyeok, Park, Young-Bae (2014) Effect of Cu–Sn intermetallic compound reactions on the Kirkendall void growth characteristics in Cu/Sn/Cu microbumps. Japanese Journal of Applied Physics, 53 (5) 5 doi:10.7567/jjap.53.05ha06
Han, Jeong In, Kim, Yong-Hoon, Park, Sung Kyu (2012) Enhanced Stability of All Solution-Processed Organic Thin-Film Transistors Using Highly Conductive Modified Polymer Electrodes. Japanese Journal of Applied Physics, 51. 91602 doi:10.1143/jjap.51.091602
 
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