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Shi, Hongbin, Tian, Cuihua, Ueda, Toshitsugu (2012) Thermomechanical Fatigue Performance of Lead-Free Chip Scale Package Assemblies with Fast Cure and Reworkable Capillary Flow Underfills. Japanese Journal of Applied Physics, 51 (5) 5 doi:10.7567/jjap.51.05ee04

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Reference TypeJournal (article/letter/editorial)
TitleThermomechanical Fatigue Performance of Lead-Free Chip Scale Package Assemblies with Fast Cure and Reworkable Capillary Flow Underfills
JournalJapanese Journal of Applied Physics
AuthorsShi, HongbinAuthor
Tian, CuihuaAuthor
Ueda, ToshitsuguAuthor
Year2012 (May 1)Volume51
Issue5
PublisherJapan Society of Applied Physics
DOIdoi:10.7567/jjap.51.05ee04Search in ResearchGate
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Mindat Ref. ID15042705Long-form Identifiermindat:1:5:15042705:8
GUID0
Full ReferenceShi, Hongbin, Tian, Cuihua, Ueda, Toshitsugu (2012) Thermomechanical Fatigue Performance of Lead-Free Chip Scale Package Assemblies with Fast Cure and Reworkable Capillary Flow Underfills. Japanese Journal of Applied Physics, 51 (5) 5 doi:10.7567/jjap.51.05ee04
Plain TextShi, Hongbin, Tian, Cuihua, Ueda, Toshitsugu (2012) Thermomechanical Fatigue Performance of Lead-Free Chip Scale Package Assemblies with Fast Cure and Reworkable Capillary Flow Underfills. Japanese Journal of Applied Physics, 51 (5) 5 doi:10.7567/jjap.51.05ee04
In(2012, May) Japanese Journal of Applied Physics Vol. 51 (5) Japan Society of Applied Physics

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Shi, Hongbin, Tian, Cuihua, Ueda, Toshitsugu (2012) Thermomechanical Fatigue Performance of Lead-Free Chip Scale Package Assemblies with Fast Cure and Reworkable Capillary Flow Underfills. Japanese Journal of Applied Physics, 51. 5 doi:10.1143/jjap.51.05ee04
Shi, Hongbin, Tian, Cuihua, Ueda, Toshitsugu (2012) Board-Level Solder Joint Reliability of Edge- and Corner-Bonded Lead-Free Chip Scale Package Assemblies Subjected to Thermal Cycling. Japanese Journal of Applied Physics, 51 (4) 4 doi:10.7567/jjap.51.04db08
Shi, Hongbin, Tian, Cuihua, Ueda, Toshitsugu (2012) Board-Level Solder Joint Reliability of Edge- and Corner-Bonded Lead-Free Chip Scale Package Assemblies Subjected to Thermal Cycling. Japanese Journal of Applied Physics, 51. 4 doi:10.1143/jjap.51.04db08
Li, Xuefeng, Lin, Shuo, Liang, Jinxing, Oigawa, Hiroshi, Ueda, Toshitsugu (2012) High-Sensitivity Fiber-Optic Fabry–Perot Interferometer Temperature Sensor. Japanese Journal of Applied Physics, 51 (6) 6 doi:10.7567/jjap.51.06fl10
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Ueda, Takeji, Nagai, Naomi, Komiyama, Susumu (2012) Ultrasensitive Far-Infrared Phototransistors Fabricated in Superlattice Structures. Japanese Journal of Applied Physics, 51 (5) 50206 doi:10.7567/jjap.51.050206
Yano, Yuichiro, Goka, Shigeyoshi (2012) Pulse Excitation Method of Coherent-Population-Trapping Suitable for Chip-Scale Atomic Clock. Japanese Journal of Applied Physics, 51 (12) 122401 doi:10.7567/jjap.51.122401
Hata, Nobuhiro, Akinaga, Hiro (2012) Characterization and Control of Nanostructure Size Variation. Japanese Journal of Applied Physics, 51 (5) 5 doi:10.7567/jjap.51.05ec05
Yasuda, Kenji (2012) On-Chip Cellomics: Constructive Understanding of Multicellular Network Using On-Chip Cellomics Technology. Japanese Journal of Applied Physics, 51 (8) 8 doi:10.7567/jjap.51.08ka03
Terazono, Hideyuki, Hayashi, Masahito, Kim, Hyonchol, Hattori, Akihiro, Yasuda, Kenji (2012) Cell-Sorting System with On-Chip Imaging for Label-Free Shape-Based Selection of Cells. Japanese Journal of Applied Physics, 51 (6) 6 doi:10.7567/jjap.51.06fk08
Li, Xuefeng, Lin, Shuo, Liang, Jinxing, Oigawa, Hiroshi, Ueda, Toshitsugu (2012) High-Sensitivity Fiber-Optic Fabry–Perot Interferometer Temperature Sensor. Japanese Journal of Applied Physics, 51. 6 doi:10.1143/jjap.51.06fl10
 
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