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Khajornrungruang, Panart, Kimura, Keiichi, Okuzono, Takahisa, Suzuki, Keisuke, Kushida, Takashi (2012) Spatial Fourier Transform Analysis of Polishing Pad Surface Topography. Japanese Journal of Applied Physics, 51 (5) 5 doi:10.7567/jjap.51.05ef04

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Reference TypeJournal (article/letter/editorial)
TitleSpatial Fourier Transform Analysis of Polishing Pad Surface Topography
JournalJapanese Journal of Applied Physics
AuthorsKhajornrungruang, PanartAuthor
Kimura, KeiichiAuthor
Okuzono, TakahisaAuthor
Suzuki, KeisukeAuthor
Kushida, TakashiAuthor
Year2012 (May 1)Volume51
Issue5
PublisherJapan Society of Applied Physics
DOIdoi:10.7567/jjap.51.05ef04Search in ResearchGate
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Mindat Ref. ID15042711Long-form Identifiermindat:1:5:15042711:9
GUID0
Full ReferenceKhajornrungruang, Panart, Kimura, Keiichi, Okuzono, Takahisa, Suzuki, Keisuke, Kushida, Takashi (2012) Spatial Fourier Transform Analysis of Polishing Pad Surface Topography. Japanese Journal of Applied Physics, 51 (5) 5 doi:10.7567/jjap.51.05ef04
Plain TextKhajornrungruang, Panart, Kimura, Keiichi, Okuzono, Takahisa, Suzuki, Keisuke, Kushida, Takashi (2012) Spatial Fourier Transform Analysis of Polishing Pad Surface Topography. Japanese Journal of Applied Physics, 51 (5) 5 doi:10.7567/jjap.51.05ef04
In(2012, May) Japanese Journal of Applied Physics Vol. 51 (5) Japan Society of Applied Physics

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Khajornrungruang, Panart, Kimura, Keiichi, Okuzono, Takahisa, Suzuki, Keisuke, Kushida, Takashi (2012) Spatial Fourier Transform Analysis of Polishing Pad Surface Topography. Japanese Journal of Applied Physics, 51. 5 doi:10.1143/jjap.51.05ef04
Khajornrungruang, Panart, Kimura, Keiichi, Yui, Ryuji, Wada, Nagisa, Suzuki, Keisuke (2011) Slurry Supplying Method for Large Quartz Glass Substrate Polishing. Japanese Journal of Applied Physics, 50 (5) 5 doi:10.7567/jjap.50.05ec03
Khajornrungruang, Panart, Kimura, Keiichi, Yui, Ryuji, Wada, Nagisa, Suzuki, Keisuke (2011) Slurry Supplying Method for Large Quartz Glass Substrate Polishing. Japanese Journal of Applied Physics, 50 (5) 5 doi:10.1143/jjap.50.05ec03
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Bun-Athuek, Natthaphon, Yoshimoto, Yutaka, Sakai, Koya, Khajornrungruang, Panart, Suzuki, Keisuke (2017) Study on effect of the surface variation of colloidal silica abrasive during chemical mechanical polishing of sapphire. Japanese Journal of Applied Physics, 56 (7) 7 doi:10.7567/jjap.56.07kb01
Bun-Athuek, Natthaphon, Takazaki, Hiroko, Yoshimoto, Yutaka, Khajornrungruang, Panart, Yasunaga, Takuo, Suzuki, Keisuke (2018) Effects of mixed ultrafine colloidal silica particles on chemical mechanical polishing of sapphire. Japanese Journal of Applied Physics, 57 (7) 7 doi:10.7567/jjap.57.07md03
Oniki, Takahiro, Khajornrungruang, Panart, Suzuki, Keisuke (2017) In situ measurement method for film thickness using transparency resin sheet with low refractive index under wet condition on chemical mechanical polishing. Japanese Journal of Applied Physics, 56 (7) 7 doi:10.7567/jjap.56.07kh02
Yamazaki, Tsutomu, Doi, Toshiro K., Uneda, Michio, Kurokawa, Syuhei, Ohnishi, Osamu, Seshimo, Kiyoshi, Aida, Hideo (2012) Effect of Groove Pattern of Chemical Mechanical Polishing Pad on Slurry Flow Behavior. Japanese Journal of Applied Physics, 51 (5) 5 doi:10.7567/jjap.51.05ef03
Yamada, Yohei, Kawakubo, Masanori, Kadomura, Kazunori (2011) Diamond Conditioner Microwear Effect on Pad Surface Height Distribution in Tungsten Chemical Mechanical Polishing. Japanese Journal of Applied Physics, 50 (5) 5 doi:10.7567/jjap.50.05ec05
Uneda, Michio, Omote, Tatsunori, Ishikawa, Ken-ichi, Ichikawa, Koichiro, Doi, Toshiro, Kurokawa, Syuhei, Ohnishi, Osamu (2012) Performance Evaluation Method of Chemical Mechanical Polishing Pad Conditioner Using Digital Image Correlation Processing. Japanese Journal of Applied Physics, 51 (5) 5 doi:10.7567/jjap.51.05ef02
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