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Chen, Chi, Li, Jiaxing, Wang, Xia, Wu, Kai, Cheng, Chuanhui, Wang, Chuang, Fu, Yuwei (2022) Transport Characteristics of Interfacial Charge in SiC Semiconductor–Epoxy Resin Packaging Materials. Frontiers in Chemistry, 10. doi:10.3389/fchem.2022.879438

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Reference TypeJournal (article/letter/editorial)
TitleTransport Characteristics of Interfacial Charge in SiC Semiconductor–Epoxy Resin Packaging Materials
JournalFrontiers in Chemistry
AuthorsChen, ChiAuthor
Li, JiaxingAuthor
Wang, XiaAuthor
Wu, KaiAuthor
Cheng, ChuanhuiAuthor
Wang, ChuangAuthor
Fu, YuweiAuthor
Year2022 (April 26)Volume10
PublisherFrontiers Media SA
DOIdoi:10.3389/fchem.2022.879438Search in ResearchGate
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Mindat Ref. ID15661890Long-form Identifiermindat:1:5:15661890:0
GUID0
Full ReferenceChen, Chi, Li, Jiaxing, Wang, Xia, Wu, Kai, Cheng, Chuanhui, Wang, Chuang, Fu, Yuwei (2022) Transport Characteristics of Interfacial Charge in SiC Semiconductor–Epoxy Resin Packaging Materials. Frontiers in Chemistry, 10. doi:10.3389/fchem.2022.879438
Plain TextChen, Chi, Li, Jiaxing, Wang, Xia, Wu, Kai, Cheng, Chuanhui, Wang, Chuang, Fu, Yuwei (2022) Transport Characteristics of Interfacial Charge in SiC Semiconductor–Epoxy Resin Packaging Materials. Frontiers in Chemistry, 10. doi:10.3389/fchem.2022.879438
In(2022) Frontiers in Chemistry Vol. 10. Frontiers Media SA

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