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Wei, Yanqiang, Jiang, Shuaicheng, Li, Jiongjiong, Tosin Aladejana, John, Zhang, Tiantian, Li, Xiaona, Dong, Youming, Li, Jianzhang (2023) A soy protein-based adhesive with improved mechanical and electromagnetic shielding properties by employment of core@double-shell BT@PDA@PANI fillers. Chemical Engineering Journal, 458. 141512 doi:10.1016/j.cej.2023.141512

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Reference TypeJournal (article/letter/editorial)
TitleA soy protein-based adhesive with improved mechanical and electromagnetic shielding properties by employment of core@double-shell BT@PDA@PANI fillers
JournalChemical Engineering Journal
AuthorsWei, YanqiangAuthor
Jiang, ShuaichengAuthor
Li, JiongjiongAuthor
Tosin Aladejana, JohnAuthor
Zhang, TiantianAuthor
Li, XiaonaAuthor
Dong, YoumingAuthor
Li, JianzhangAuthor
Year2023 (February)Volume458
PublisherElsevier BV
DOIdoi:10.1016/j.cej.2023.141512Search in ResearchGate
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Mindat Ref. ID15674680Long-form Identifiermindat:1:5:15674680:1
GUID0
Full ReferenceWei, Yanqiang, Jiang, Shuaicheng, Li, Jiongjiong, Tosin Aladejana, John, Zhang, Tiantian, Li, Xiaona, Dong, Youming, Li, Jianzhang (2023) A soy protein-based adhesive with improved mechanical and electromagnetic shielding properties by employment of core@double-shell BT@PDA@PANI fillers. Chemical Engineering Journal, 458. 141512 doi:10.1016/j.cej.2023.141512
Plain TextWei, Yanqiang, Jiang, Shuaicheng, Li, Jiongjiong, Tosin Aladejana, John, Zhang, Tiantian, Li, Xiaona, Dong, Youming, Li, Jianzhang (2023) A soy protein-based adhesive with improved mechanical and electromagnetic shielding properties by employment of core@double-shell BT@PDA@PANI fillers. Chemical Engineering Journal, 458. 141512 doi:10.1016/j.cej.2023.141512
In(2023) Chemical Engineering Journal Vol. 458. Elsevier BV


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