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Li, Yue, Wang, Yongxin, Wang, Ying, Wu, Yutao (2023) Achieving Good Bonding Strength of the Cu Layer on PET Films by Pretreatment of a Mixed Plasma of Carbon and Copper. ACS Applied Materials & Interfaces, 15 (9) 12590-12602 doi:10.1021/acsami.2c23144

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Reference TypeJournal (article/letter/editorial)
TitleAchieving Good Bonding Strength of the Cu Layer on PET Films by Pretreatment of a Mixed Plasma of Carbon and Copper
JournalACS Applied Materials & Interfaces
AuthorsLi, YueAuthor
Wang, YongxinAuthor
Wang, YingAuthor
Wu, YutaoAuthor
Year2023 (March 8)Volume15
Issue9
PublisherAmerican Chemical Society (ACS)
DOIdoi:10.1021/acsami.2c23144Search in ResearchGate
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Mindat Ref. ID15740050Long-form Identifiermindat:1:5:15740050:4
GUID0
Full ReferenceLi, Yue, Wang, Yongxin, Wang, Ying, Wu, Yutao (2023) Achieving Good Bonding Strength of the Cu Layer on PET Films by Pretreatment of a Mixed Plasma of Carbon and Copper. ACS Applied Materials & Interfaces, 15 (9) 12590-12602 doi:10.1021/acsami.2c23144
Plain TextLi, Yue, Wang, Yongxin, Wang, Ying, Wu, Yutao (2023) Achieving Good Bonding Strength of the Cu Layer on PET Films by Pretreatment of a Mixed Plasma of Carbon and Copper. ACS Applied Materials & Interfaces, 15 (9) 12590-12602 doi:10.1021/acsami.2c23144
In(2023, March) ACS Applied Materials & Interfaces Vol. 15 (9) American Chemical Society (ACS)

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