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Fan, Mengjin, Li, Xiangyuan, Zhang, Junying, Cheng, Jue (2015) Curing kinetics and shape-memory behavior of an intrinsically toughened epoxy resin system. Journal of Thermal Analysis and Calorimetry, 119 (1) 537-546 doi:10.1007/s10973-014-4106-7

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Reference TypeJournal (article/letter/editorial)
TitleCuring kinetics and shape-memory behavior of an intrinsically toughened epoxy resin system
JournalJournal of Thermal Analysis and Calorimetry
AuthorsFan, MengjinAuthor
Li, XiangyuanAuthor
Zhang, JunyingAuthor
Cheng, JueAuthor
Year2015 (January)Volume119
Issue1
PublisherSpringer Science and Business Media LLC
DOIdoi:10.1007/s10973-014-4106-7Search in ResearchGate
Generate Citation Formats
Mindat Ref. ID16451293Long-form Identifiermindat:1:5:16451293:1
GUID0
Full ReferenceFan, Mengjin, Li, Xiangyuan, Zhang, Junying, Cheng, Jue (2015) Curing kinetics and shape-memory behavior of an intrinsically toughened epoxy resin system. Journal of Thermal Analysis and Calorimetry, 119 (1) 537-546 doi:10.1007/s10973-014-4106-7
Plain TextFan, Mengjin, Li, Xiangyuan, Zhang, Junying, Cheng, Jue (2015) Curing kinetics and shape-memory behavior of an intrinsically toughened epoxy resin system. Journal of Thermal Analysis and Calorimetry, 119 (1) 537-546 doi:10.1007/s10973-014-4106-7
In(2015, January) Journal of Thermal Analysis and Calorimetry Vol. 119 (1) Springer Science and Business Media LLC

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Liu, Jialin, Li, Jingrui, Fan, Mengjin, Zhang, Junying, Cheng, Jue (2014) Comparative curing kinetics of 1,4-bis (4-diaminobenzene-1-oxygen) n-butane and 4,4′-bis-(diaminodiphenyl) methane with tetraglycidyl methylene dianiline systems. Journal of Thermal Analysis and Calorimetry, 117 (2) 603-610 doi:10.1007/s10973-014-3782-7
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Kumar, Sudheer, Samal, Sushanta K., Mohanty, Smita, Nayak, Sanjay K. (2019) Curing kinetics of bio-based epoxy resin-toughened DGEBA epoxy resin blend. Journal of Thermal Analysis and Calorimetry, 137 (5) 1567-1578 doi:10.1007/s10973-019-08080-4
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