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Hsu, Chih-Neng, Huang, Chun-Chieh, Wu, Yu-Hsuan (2015) Effect of heat convection on the thermal and structure stress of high-power InGaN light-emitting diode. Journal of Thermal Analysis and Calorimetry, 119 (2) 1245-1257 doi:10.1007/s10973-014-4221-5

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Reference TypeJournal (article/letter/editorial)
TitleEffect of heat convection on the thermal and structure stress of high-power InGaN light-emitting diode
JournalJournal of Thermal Analysis and Calorimetry
AuthorsHsu, Chih-NengAuthor
Huang, Chun-ChiehAuthor
Wu, Yu-HsuanAuthor
Year2015 (February)Volume119
Issue2
PublisherSpringer Science and Business Media LLC
DOIdoi:10.1007/s10973-014-4221-5Search in ResearchGate
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Mindat Ref. ID16451328Long-form Identifiermindat:1:5:16451328:0
GUID0
Full ReferenceHsu, Chih-Neng, Huang, Chun-Chieh, Wu, Yu-Hsuan (2015) Effect of heat convection on the thermal and structure stress of high-power InGaN light-emitting diode. Journal of Thermal Analysis and Calorimetry, 119 (2) 1245-1257 doi:10.1007/s10973-014-4221-5
Plain TextHsu, Chih-Neng, Huang, Chun-Chieh, Wu, Yu-Hsuan (2015) Effect of heat convection on the thermal and structure stress of high-power InGaN light-emitting diode. Journal of Thermal Analysis and Calorimetry, 119 (2) 1245-1257 doi:10.1007/s10973-014-4221-5
In(2015, February) Journal of Thermal Analysis and Calorimetry Vol. 119 (2) Springer Science and Business Media LLC

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