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Qin, Aning, Liu, Dandan, Chen, Chong, Liu, Shuhong, Du, Yong, Wang, Man, Nash, Philip (2015) Heat contents of Sc5Si3 and ScSi intermetallics and thermodynamic modeling of the Sc–Si system. Journal of Thermal Analysis and Calorimetry, 119 (2) 1315-1321 doi:10.1007/s10973-014-4216-2

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Reference TypeJournal (article/letter/editorial)
TitleHeat contents of Sc5Si3 and ScSi intermetallics and thermodynamic modeling of the Sc–Si system
JournalJournal of Thermal Analysis and Calorimetry
AuthorsQin, AningAuthor
Liu, DandanAuthor
Chen, ChongAuthor
Liu, ShuhongAuthor
Du, YongAuthor
Wang, ManAuthor
Nash, PhilipAuthor
Year2015 (February)Volume119
Issue2
PublisherSpringer Science and Business Media LLC
DOIdoi:10.1007/s10973-014-4216-2Search in ResearchGate
Generate Citation Formats
Mindat Ref. ID16451370Long-form Identifiermindat:1:5:16451370:9
GUID0
Full ReferenceQin, Aning, Liu, Dandan, Chen, Chong, Liu, Shuhong, Du, Yong, Wang, Man, Nash, Philip (2015) Heat contents of Sc5Si3 and ScSi intermetallics and thermodynamic modeling of the Sc–Si system. Journal of Thermal Analysis and Calorimetry, 119 (2) 1315-1321 doi:10.1007/s10973-014-4216-2
Plain TextQin, Aning, Liu, Dandan, Chen, Chong, Liu, Shuhong, Du, Yong, Wang, Man, Nash, Philip (2015) Heat contents of Sc5Si3 and ScSi intermetallics and thermodynamic modeling of the Sc–Si system. Journal of Thermal Analysis and Calorimetry, 119 (2) 1315-1321 doi:10.1007/s10973-014-4216-2
In(2015, February) Journal of Thermal Analysis and Calorimetry Vol. 119 (2) Springer Science and Business Media LLC

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