Hemmat Esfe, Mohammad, Esfandeh, Saeed (2019) Rheological behavior of CuO/EG:W (20:80 v/v) nanofluid from a thermal perspective. Journal of Thermal Analysis and Calorimetry, 135 (1) 61-72 doi:10.1007/s10973-018-7082-5
Reference Type | Journal (article/letter/editorial) | ||
---|---|---|---|
Title | Rheological behavior of CuO/EG:W (20:80 v/v) nanofluid from a thermal perspective | ||
Journal | Journal of Thermal Analysis and Calorimetry | ||
Authors | Hemmat Esfe, Mohammad | Author | |
Esfandeh, Saeed | Author | ||
Year | 2019 (January) | Volume | 135 |
Issue | 1 | ||
Publisher | Springer Science and Business Media LLC | ||
DOI | doi:10.1007/s10973-018-7082-5Search in ResearchGate | ||
Generate Citation Formats | |||
Mindat Ref. ID | 16454677 | Long-form Identifier | mindat:1:5:16454677:6 |
GUID | 0 | ||
Full Reference | Hemmat Esfe, Mohammad, Esfandeh, Saeed (2019) Rheological behavior of CuO/EG:W (20:80 v/v) nanofluid from a thermal perspective. Journal of Thermal Analysis and Calorimetry, 135 (1) 61-72 doi:10.1007/s10973-018-7082-5 | ||
Plain Text | Hemmat Esfe, Mohammad, Esfandeh, Saeed (2019) Rheological behavior of CuO/EG:W (20:80 v/v) nanofluid from a thermal perspective. Journal of Thermal Analysis and Calorimetry, 135 (1) 61-72 doi:10.1007/s10973-018-7082-5 | ||
In | (2019, January) Journal of Thermal Analysis and Calorimetry Vol. 135 (1) Springer Science and Business Media LLC |
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