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Guo, Erjun, Wang, Lei, Feng, Yicheng, Wang, Liping, Chen, Yanhong (2019) Effect of cooling rate on the microstructure and solidification parameters of Mg–3Al–3Nd alloy. Journal of Thermal Analysis and Calorimetry, 135 (4) 2001-2008 doi:10.1007/s10973-018-7446-x

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Reference TypeJournal (article/letter/editorial)
TitleEffect of cooling rate on the microstructure and solidification parameters of Mg–3Al–3Nd alloy
JournalJournal of Thermal Analysis and Calorimetry
AuthorsGuo, ErjunAuthor
Wang, LeiAuthor
Feng, YichengAuthor
Wang, LipingAuthor
Chen, YanhongAuthor
Year2019 (February)Volume135
Issue4
PublisherSpringer Science and Business Media LLC
DOIdoi:10.1007/s10973-018-7446-xSearch in ResearchGate
Generate Citation Formats
Mindat Ref. ID16454795Long-form Identifiermindat:1:5:16454795:7
GUID0
Full ReferenceGuo, Erjun, Wang, Lei, Feng, Yicheng, Wang, Liping, Chen, Yanhong (2019) Effect of cooling rate on the microstructure and solidification parameters of Mg–3Al–3Nd alloy. Journal of Thermal Analysis and Calorimetry, 135 (4) 2001-2008 doi:10.1007/s10973-018-7446-x
Plain TextGuo, Erjun, Wang, Lei, Feng, Yicheng, Wang, Liping, Chen, Yanhong (2019) Effect of cooling rate on the microstructure and solidification parameters of Mg–3Al–3Nd alloy. Journal of Thermal Analysis and Calorimetry, 135 (4) 2001-2008 doi:10.1007/s10973-018-7446-x
In(2019, February) Journal of Thermal Analysis and Calorimetry Vol. 135 (4) Springer Science and Business Media LLC

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