| Reference Type | Journal (article/letter/editorial) |
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| Title | Modeling the Copper Electrodeposition of Through-silicon-vias Corresponded to Linear Sweep Voltammetry |
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| Journal | Electrochemistry |
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| Authors | LUO, Wei | Author |
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| ZHANG, Junhong | Author |
| CHEN, Zhipeng | Author |
| ZHU, Ying | Author |
| GAO, Liming | Author |
| LI, Ming | Author |
| Year | 2016 | Volume | 84 |
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| Issue | 7 |
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| Publisher | The Electrochemical Society of Japan |
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| DOI | doi:10.5796/electrochemistry.84.516Search in ResearchGate |
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| Generate Citation Formats |
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| Mindat Ref. ID | 16507687 | Long-form Identifier | mindat:1:5:16507687:6 |
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|
| GUID | 0 |
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| Full Reference | LUO, Wei, ZHANG, Junhong, CHEN, Zhipeng, ZHU, Ying, GAO, Liming, LI, Ming (2016) Modeling the Copper Electrodeposition of Through-silicon-vias Corresponded to Linear Sweep Voltammetry. Electrochemistry, 84 (7) 516-522 doi:10.5796/electrochemistry.84.516 |
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| Plain Text | LUO, Wei, ZHANG, Junhong, CHEN, Zhipeng, ZHU, Ying, GAO, Liming, LI, Ming (2016) Modeling the Copper Electrodeposition of Through-silicon-vias Corresponded to Linear Sweep Voltammetry. Electrochemistry, 84 (7) 516-522 doi:10.5796/electrochemistry.84.516 |
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| In | (2016) Electrochemistry Vol. 84 (7) The Electrochemical Society of Japan |
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