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Liu, Wei, Lu, Yongheng, Shao, Zongyi, Meng, Ying, Shan, Tipeng, Sun, Liangbo (2023) Study on the Microstructure of SiC Ceramic Joint Bonding by CaO-Al2O3 Glass-ceramic Solder. Journal of Physics: Conference Series, 2557 (1) IOP Publishing. 12100 doi:10.1088/1742-6596/2557/1/012100

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Reference TypeJournal (article/letter/editorial)
TitleStudy on the Microstructure of SiC Ceramic Joint Bonding by CaO-Al2O3 Glass-ceramic Solder
JournalJournal of Physics: Conference Series
AuthorsLiu, WeiAuthor
Lu, YonghengAuthor
Shao, ZongyiAuthor
Meng, YingAuthor
Shan, TipengAuthor
Sun, LiangboAuthor
Year2023 (July 1)Volume2557
Issue1
PublisherIOP Publishing
DOIdoi:10.1088/1742-6596/2557/1/012100Search in ResearchGate
Generate Citation Formats
Mindat Ref. ID16649848Long-form Identifiermindat:1:5:16649848:6
GUID0
Full ReferenceLiu, Wei, Lu, Yongheng, Shao, Zongyi, Meng, Ying, Shan, Tipeng, Sun, Liangbo (2023) Study on the Microstructure of SiC Ceramic Joint Bonding by CaO-Al2O3 Glass-ceramic Solder. Journal of Physics: Conference Series, 2557 (1) IOP Publishing. 12100 doi:10.1088/1742-6596/2557/1/012100
Plain TextLiu, Wei, Lu, Yongheng, Shao, Zongyi, Meng, Ying, Shan, Tipeng, Sun, Liangbo (2023) Study on the Microstructure of SiC Ceramic Joint Bonding by CaO-Al2O3 Glass-ceramic Solder. Journal of Physics: Conference Series, 2557 (1) IOP Publishing. 12100 doi:10.1088/1742-6596/2557/1/012100
In(2023, July) Journal of Physics: Conference Series Vol. 2557 (1) IOP Publishing

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