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Jang, Dong Min, Yu, Jin (2011) Intermetallic compound spalling characteristics of Sn-3.5Ag solder over ternary electroless Ni under-bump metallurgy. Journal of Materials Research, 26 (24) 3032-3037 doi:10.1557/jmr.2011.371

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Reference TypeJournal (article/letter/editorial)
TitleIntermetallic compound spalling characteristics of Sn-3.5Ag solder over ternary electroless Ni under-bump metallurgy
JournalJournal of Materials Research
AuthorsJang, Dong MinAuthor
Yu, JinAuthor
Year2011 (December 28)Volume26
Issue24
PublisherSpringer Science and Business Media LLC
DOIdoi:10.1557/jmr.2011.371Search in ResearchGate
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Mindat Ref. ID17102416Long-form Identifiermindat:1:5:17102416:8
GUID0
Full ReferenceJang, Dong Min, Yu, Jin (2011) Intermetallic compound spalling characteristics of Sn-3.5Ag solder over ternary electroless Ni under-bump metallurgy. Journal of Materials Research, 26 (24) 3032-3037 doi:10.1557/jmr.2011.371
Plain TextJang, Dong Min, Yu, Jin (2011) Intermetallic compound spalling characteristics of Sn-3.5Ag solder over ternary electroless Ni under-bump metallurgy. Journal of Materials Research, 26 (24) 3032-3037 doi:10.1557/jmr.2011.371
In(2011, December) Journal of Materials Research Vol. 26 (24) Springer Science and Business Media LLC

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Jang, Dong Min, Yu, Jin (2011) Tungsten alloying of the Ni(P) films and the reliability of Sn–3.5Ag/NiWP solder joints. Journal of Materials Research, 26 (7) 889-895 doi:10.1557/jmr.2011.17
Huang, Chang Pin, Chen, Chih, Liu, C.Y., Lin, S.S., Chen, K.H. (2005) Metallurgical reactions of Sn-3.5Ag solder with various thicknesses of electroplated Ni/Cu under bump metallization. Journal of Materials Research, 20 (10) 2772-2779 doi:10.1557/jmr.2005.0334
Chen, Hsiao-Yun, Chen, Chih (2012) Kinetic study of the intermetallic compound formation between eutectic Sn–3.5Ag alloys and electroplated Ni metallization in flip-chip solder joints. Journal of Materials Research, 27 (8) 1169-1177 doi:10.1557/jmr.2012.22
Jee, Y.K., Yu, Jin, Ko, Y.H. (2007) Effects of Zn addition on the drop reliability of Sn–3.5Ag–xZn/Ni(P) solder joints. Journal of Materials Research, 22 (10) 2776-2784 doi:10.1557/jmr.2007.0346
Kim, S.H., Yu, Jin (2010) Secondary IMC formation induced by Kirkendall voiding in Cu/Sn–3.5Ag solder joints. Journal of Materials Research, 25 (9) 1854-1858 doi:10.1557/jmr.2010.0232
Chen, Hsiao-Yun, Chen, Chih (2011) Thermomigration of Cu–Sn and Ni–Sn intermetallic compounds during electromigration in Pb-free SnAg solder joints. Journal of Materials Research, 26 (8) 983-991 doi:10.1557/jmr.2011.25
Sohn, Y.C., Yu, Jin, Kang, S.K., Shih, D.Y., Lee, T.Y. (2004) Spalling of intermetallic compounds during the reaction between lead-free solders and electroless Ni-P metallization. Journal of Materials Research, 19 (8) 2428-2436 doi:10.1557/jmr.2004.0297
Wang, Kai-Jheng, Tsai, Yan-Zuo, Duh, Jenq-Gong, Shih, Toung-Yi (2009) Formation mechanism of Sn-patch between SnAgCu solder and Ti/Ni(V)/Cu under bump metallization. Journal of Materials Research, 24 (8) 2638-2643 doi:10.1557/jmr.2009.0315
Jee, Y.K., Ko, Y.H., Yu, Jin (2007) Effect of Zn on the intermetallics formation and reliability of Sn-3.5Ag solder on a Cu pad. Journal of Materials Research, 22 (7) 1879-1887 doi:10.1557/jmr.2007.0234
Kim, J.Y., Sohn, Y.C., Yu, Jin (2007) Effect of Cu content on the mechanical reliability of Ni/Sn–3.5Ag system. Journal of Materials Research, 22 (3) 770-776 doi:10.1557/jmr.2007.0085
Kang, Han-Byul, Lee, Jae-Wook, Bae, Jee-Hwan, Park, Min-Ho, Yoon, Jeong-Won, Jung, Seung-Boo, Ju, Jae-Seon, Yang, Cheol-Woong (2008) Initial interfacial reaction layers formed in Sn–3.5Ag solder/electroless Ni–P plated Cu substrate system. Journal of Materials Research, 23 (8) 2195-2201 doi:10.1557/jmr.2008.0266
 
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