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Dewi, Wiwiek Utami, Sutrisna, Rizky, Supriyatno, Heru, Astutiningsih, Sotya, Chalid, Mochamad (2024) Curing Kinetics of Epoxy Adhesive by Non-Isothermal DSC. Materials Science Forum, 1114. 145-152 doi:10.4028/p-e5vlmg

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Reference TypeJournal (article/letter/editorial)
TitleCuring Kinetics of Epoxy Adhesive by Non-Isothermal DSC
JournalMaterials Science Forum
AuthorsDewi, Wiwiek UtamiAuthor
Sutrisna, RizkyAuthor
Supriyatno, HeruAuthor
Astutiningsih, SotyaAuthor
Chalid, MochamadAuthor
Year2024 (February 22)Volume1114
PublisherTrans Tech Publications, Ltd.
DOIdoi:10.4028/p-e5vlmgSearch in ResearchGate
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Mindat Ref. ID17192015Long-form Identifiermindat:1:5:17192015:6
GUID0
Full ReferenceDewi, Wiwiek Utami, Sutrisna, Rizky, Supriyatno, Heru, Astutiningsih, Sotya, Chalid, Mochamad (2024) Curing Kinetics of Epoxy Adhesive by Non-Isothermal DSC. Materials Science Forum, 1114. 145-152 doi:10.4028/p-e5vlmg
Plain TextDewi, Wiwiek Utami, Sutrisna, Rizky, Supriyatno, Heru, Astutiningsih, Sotya, Chalid, Mochamad (2024) Curing Kinetics of Epoxy Adhesive by Non-Isothermal DSC. Materials Science Forum, 1114. 145-152 doi:10.4028/p-e5vlmg
In(2024) Materials Science Forum Vol. 1114. Trans Tech Publications, Ltd.

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