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Zhou, Xinfeng, Min, Peng, Liu, Yue, Jin, Meng, Yu, Zhong-Zhen, Zhang, Hao-Bin (2024) Insulating electromagnetic-shielding silicone compound enables direct potting electronics. Science, 385 (6714). doi:10.1126/science.adp6581

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Reference TypeJournal (article/letter/editorial)
TitleInsulating electromagnetic-shielding silicone compound enables direct potting electronics
JournalScience
AuthorsZhou, XinfengAuthor
Min, PengAuthor
Liu, YueAuthor
Jin, MengAuthor
Yu, Zhong-ZhenAuthor
Zhang, Hao-BinAuthor
Year2024 (September 13)Volume385
Issue6714
PublisherAmerican Association for the Advancement of Science (AAAS)
DOIdoi:10.1126/science.adp6581Search in ResearchGate
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Mindat Ref. ID17593996Long-form Identifiermindat:1:5:17593996:3
GUID0
Full ReferenceZhou, Xinfeng, Min, Peng, Liu, Yue, Jin, Meng, Yu, Zhong-Zhen, Zhang, Hao-Bin (2024) Insulating electromagnetic-shielding silicone compound enables direct potting electronics. Science, 385 (6714). doi:10.1126/science.adp6581
Plain TextZhou, Xinfeng, Min, Peng, Liu, Yue, Jin, Meng, Yu, Zhong-Zhen, Zhang, Hao-Bin (2024) Insulating electromagnetic-shielding silicone compound enables direct potting electronics. Science, 385 (6714). doi:10.1126/science.adp6581
In(2024, September) Science Vol. 385 (6714). American Association for the Advancement of Science (AAAS)

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