Ding, Shanjun, Wu, Xiaomeng, Chen, Chuan, Gui, Mengqi, Sun, Peng, Yang, Fang, Zhang, Xu, Fang, Zhidan, Wang, Qidong (2025) Enhanced adhesion strength of copper deposited epoxy composite films for chip substrates by tuning copper oxide and internal stress. Applied Surface Science, 684. doi:10.1016/j.apsusc.2024.161911
| Reference Type | Journal (article/letter/editorial) | ||
|---|---|---|---|
| Title | Enhanced adhesion strength of copper deposited epoxy composite films for chip substrates by tuning copper oxide and internal stress | ||
| Journal | Applied Surface Science | ||
| Authors | Ding, Shanjun | Author | |
| Wu, Xiaomeng | Author | ||
| Chen, Chuan | Author | ||
| Gui, Mengqi | Author | ||
| Sun, Peng | Author | ||
| Yang, Fang | Author | ||
| Zhang, Xu | Author | ||
| Fang, Zhidan | Author | ||
| Wang, Qidong | Author | ||
| Year | 2025 (March) | Volume | 684 |
| Publisher | Elsevier BV | ||
| DOI | doi:10.1016/j.apsusc.2024.161911Search in ResearchGate | ||
| Generate Citation Formats | |||
| Mindat Ref. ID | 17754328 | Long-form Identifier | mindat:1:5:17754328:1 |
| GUID | 0 | ||
| Full Reference | Ding, Shanjun, Wu, Xiaomeng, Chen, Chuan, Gui, Mengqi, Sun, Peng, Yang, Fang, Zhang, Xu, Fang, Zhidan, Wang, Qidong (2025) Enhanced adhesion strength of copper deposited epoxy composite films for chip substrates by tuning copper oxide and internal stress. Applied Surface Science, 684. doi:10.1016/j.apsusc.2024.161911 | ||
| Plain Text | Ding, Shanjun, Wu, Xiaomeng, Chen, Chuan, Gui, Mengqi, Sun, Peng, Yang, Fang, Zhang, Xu, Fang, Zhidan, Wang, Qidong (2025) Enhanced adhesion strength of copper deposited epoxy composite films for chip substrates by tuning copper oxide and internal stress. Applied Surface Science, 684. doi:10.1016/j.apsusc.2024.161911 | ||
| In | (2025) Applied Surface Science Vol. 684. Elsevier BV | ||
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