Reference Type | Journal (article/letter/editorial) |
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Title | Ni–P–SiC composite produced by pulse and direct current plating |
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Journal | Materials Chemistry and Physics |
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Authors | Hou, Kung-Hsu | Author |
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Hwu, Wen-Hwa | Author |
Ke, Shih-Tsung | Author |
Ger, Ming-Der | Author |
Year | 2006 (November) | Volume | 100 |
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Publisher | Elsevier BV |
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DOI | doi:10.1016/j.matchemphys.2005.12.016Search in ResearchGate |
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| Generate Citation Formats |
Mindat Ref. ID | 3054902 | Long-form Identifier | mindat:1:5:3054902:3 |
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GUID | 0 |
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Full Reference | Hou, Kung-Hsu, Hwu, Wen-Hwa, Ke, Shih-Tsung, Ger, Ming-Der (2006) Ni–P–SiC composite produced by pulse and direct current plating. Materials Chemistry and Physics, 100. 54-59 doi:10.1016/j.matchemphys.2005.12.016 |
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Plain Text | Hou, Kung-Hsu, Hwu, Wen-Hwa, Ke, Shih-Tsung, Ger, Ming-Der (2006) Ni–P–SiC composite produced by pulse and direct current plating. Materials Chemistry and Physics, 100. 54-59 doi:10.1016/j.matchemphys.2005.12.016 |
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In | (2006, November) Materials Chemistry and Physics Vol. 100 (1) Elsevier BV |
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