Wierzbicka-Miernik, A., Miernik, K., Wojewoda-Budka, J., Szyszkiewicz, K., Filipek, R., Litynska-Dobrzynska, L., Kodentsov, A., Zieba, P. (2013) Growth kinetics of the intermetallic phase in diffusion-soldered (Cu–5 at.%Ni)/Sn/(Cu–5 at.%Ni) interconnections. Materials Chemistry and Physics, 142. 682-685 doi:10.1016/j.matchemphys.2013.08.022
| Reference Type | Journal (article/letter/editorial) | ||
|---|---|---|---|
| Title | Growth kinetics of the intermetallic phase in diffusion-soldered (Cu–5 at.%Ni)/Sn/(Cu–5 at.%Ni) interconnections | ||
| Journal | Materials Chemistry and Physics | ||
| Authors | Wierzbicka-Miernik, A. | Author | |
| Miernik, K. | Author | ||
| Wojewoda-Budka, J. | Author | ||
| Szyszkiewicz, K. | Author | ||
| Filipek, R. | Author | ||
| Litynska-Dobrzynska, L. | Author | ||
| Kodentsov, A. | Author | ||
| Zieba, P. | Author | ||
| Year | 2013 (November) | Volume | 142 |
| Publisher | Elsevier BV | ||
| DOI | doi:10.1016/j.matchemphys.2013.08.022Search in ResearchGate | ||
| Generate Citation Formats | |||
| Mindat Ref. ID | 3060610 | Long-form Identifier | mindat:1:5:3060610:6 |
| GUID | 0 | ||
| Full Reference | Wierzbicka-Miernik, A., Miernik, K., Wojewoda-Budka, J., Szyszkiewicz, K., Filipek, R., Litynska-Dobrzynska, L., Kodentsov, A., Zieba, P. (2013) Growth kinetics of the intermetallic phase in diffusion-soldered (Cu–5 at.%Ni)/Sn/(Cu–5 at.%Ni) interconnections. Materials Chemistry and Physics, 142. 682-685 doi:10.1016/j.matchemphys.2013.08.022 | ||
| Plain Text | Wierzbicka-Miernik, A., Miernik, K., Wojewoda-Budka, J., Szyszkiewicz, K., Filipek, R., Litynska-Dobrzynska, L., Kodentsov, A., Zieba, P. (2013) Growth kinetics of the intermetallic phase in diffusion-soldered (Cu–5 at.%Ni)/Sn/(Cu–5 at.%Ni) interconnections. Materials Chemistry and Physics, 142. 682-685 doi:10.1016/j.matchemphys.2013.08.022 | ||
| In | (2013, November) Materials Chemistry and Physics Vol. 142 (2) Elsevier BV | ||
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