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Song, Young Sik, Yim, TaiHong, Park, Soo-Keun, Lee, Jae-Ho, Kim, Jongryoul (2013) Metal seed layer sputtering on high aspect ratio through-silicon-vias for copper filling electroplating. Electrochimica Acta, 114. 832-837 doi:10.1016/j.electacta.2013.09.096

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Reference TypeJournal (article/letter/editorial)
TitleMetal seed layer sputtering on high aspect ratio through-silicon-vias for copper filling electroplating
JournalElectrochimica Acta
AuthorsSong, Young SikAuthor
Yim, TaiHongAuthor
Park, Soo-KeunAuthor
Lee, Jae-HoAuthor
Kim, JongryoulAuthor
Year2013 (December)Volume114
PublisherElsevier BV
DOIdoi:10.1016/j.electacta.2013.09.096Search in ResearchGate
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Mindat Ref. ID3202092Long-form Identifiermindat:1:5:3202092:0
GUID0
Full ReferenceSong, Young Sik, Yim, TaiHong, Park, Soo-Keun, Lee, Jae-Ho, Kim, Jongryoul (2013) Metal seed layer sputtering on high aspect ratio through-silicon-vias for copper filling electroplating. Electrochimica Acta, 114. 832-837 doi:10.1016/j.electacta.2013.09.096
Plain TextSong, Young Sik, Yim, TaiHong, Park, Soo-Keun, Lee, Jae-Ho, Kim, Jongryoul (2013) Metal seed layer sputtering on high aspect ratio through-silicon-vias for copper filling electroplating. Electrochimica Acta, 114. 832-837 doi:10.1016/j.electacta.2013.09.096
In(2013) Electrochimica Acta Vol. 114. Elsevier BV

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