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Tuah-Poku, Isaac, Dollar, M., Massalski, T.B. (1988) A study of the transient liquid phase bonding process applied to a Ag/Cu/Ag sandwich joint. Metallurgical Transactions A, 19 (3). 675-686 doi:10.1007/bf02649282

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Reference TypeJournal (article/letter/editorial)
TitleA study of the transient liquid phase bonding process applied to a Ag/Cu/Ag sandwich joint
JournalMetallurgical Transactions A
AuthorsTuah-Poku, IsaacAuthor
Dollar, M.Author
Massalski, T.B.Author
Year1988 (March)Volume19
Issue3
PublisherSpringer Science and Business Media LLC
DOIdoi:10.1007/bf02649282Search in ResearchGate
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Mindat Ref. ID4773411Long-form Identifiermindat:1:5:4773411:5
GUID0
Full ReferenceTuah-Poku, Isaac, Dollar, M., Massalski, T.B. (1988) A study of the transient liquid phase bonding process applied to a Ag/Cu/Ag sandwich joint. Metallurgical Transactions A, 19 (3). 675-686 doi:10.1007/bf02649282
Plain TextTuah-Poku, Isaac, Dollar, M., Massalski, T.B. (1988) A study of the transient liquid phase bonding process applied to a Ag/Cu/Ag sandwich joint. Metallurgical Transactions A, 19 (3). 675-686 doi:10.1007/bf02649282
In(1988, March) Metallurgical Transactions A Vol. 19 (3) Springer Science and Business Media LLC


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