Reference Type | Journal (article/letter/editorial) |
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Title | Mass diffusion in polycrystalline copper/electroplated gold planar couples |
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Journal | Metallurgical and Materials Transactions B |
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Authors | Pinnel, M. R. | Author |
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Bennett, J. E. | Author |
Year | 1972 (July) | Volume | 3 |
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Issue | 7 |
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Publisher | Springer Science and Business Media LLC |
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DOI | doi:10.1007/bf02642589Search in ResearchGate |
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| Generate Citation Formats |
Mindat Ref. ID | 4782018 | Long-form Identifier | mindat:1:5:4782018:4 |
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GUID | 0 |
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Full Reference | Pinnel, M. R., Bennett, J. E. (1972) Mass diffusion in polycrystalline copper/electroplated gold planar couples. Metallurgical and Materials Transactions B, 3 (7). 1989-1997 doi:10.1007/bf02642589 |
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Plain Text | Pinnel, M. R., Bennett, J. E. (1972) Mass diffusion in polycrystalline copper/electroplated gold planar couples. Metallurgical and Materials Transactions B, 3 (7). 1989-1997 doi:10.1007/bf02642589 |
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In | (1972, July) Metallurgical and Materials Transactions B Vol. 3 (7) Springer Science and Business Media LLC |
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