Park, Joong Kil, Samarasekera, Indira V., Thomas, Brian G., Yoon, U. Sok (2002) Thermal and mechanical behavior of copper molds during thin-slab casting (II): Mold crack formation. Metallurgical and Materials Transactions B, 33 (3). 437-449 doi:10.1007/s11663-002-0055-9
Reference Type | Journal (article/letter/editorial) | ||
---|---|---|---|
Title | Thermal and mechanical behavior of copper molds during thin-slab casting (II): Mold crack formation | ||
Journal | Metallurgical and Materials Transactions B | ||
Authors | Park, Joong Kil | Author | |
Samarasekera, Indira V. | Author | ||
Thomas, Brian G. | Author | ||
Yoon, U. Sok | Author | ||
Year | 2002 (June) | Volume | 33 |
Issue | 3 | ||
Publisher | Springer Science and Business Media LLC | ||
DOI | doi:10.1007/s11663-002-0055-9Search in ResearchGate | ||
Generate Citation Formats | |||
Mindat Ref. ID | 4786072 | Long-form Identifier | mindat:1:5:4786072:0 |
GUID | 0 | ||
Full Reference | Park, Joong Kil, Samarasekera, Indira V., Thomas, Brian G., Yoon, U. Sok (2002) Thermal and mechanical behavior of copper molds during thin-slab casting (II): Mold crack formation. Metallurgical and Materials Transactions B, 33 (3). 437-449 doi:10.1007/s11663-002-0055-9 | ||
Plain Text | Park, Joong Kil, Samarasekera, Indira V., Thomas, Brian G., Yoon, U. Sok (2002) Thermal and mechanical behavior of copper molds during thin-slab casting (II): Mold crack formation. Metallurgical and Materials Transactions B, 33 (3). 437-449 doi:10.1007/s11663-002-0055-9 | ||
In | (2002, June) Metallurgical and Materials Transactions B Vol. 33 (3) Springer Science and Business Media LLC |
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