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Sun, Chang Q., Fu, Y. Q., Yan, B. B., Hsieh, J. H., Lau, S. P., Sun, X. W., Tay, B. K. (2002) Improving diamond–metal adhesion with graded TiCN interlayers. Journal of Applied Physics, 91 (4). 2051-2054 doi:10.1063/1.1434546

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Reference TypeJournal (article/letter/editorial)
TitleImproving diamond–metal adhesion with graded TiCN interlayers
JournalJournal of Applied Physics
AuthorsSun, Chang Q.Author
Fu, Y. Q.Author
Yan, B. B.Author
Hsieh, J. H.Author
Lau, S. P.Author
Sun, X. W.Author
Tay, B. K.Author
Year2002 (February 15)Volume91
Issue4
PublisherAIP Publishing
DOIdoi:10.1063/1.1434546Search in ResearchGate
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Mindat Ref. ID5113760Long-form Identifiermindat:1:5:5113760:1
GUID0
Full ReferenceSun, Chang Q., Fu, Y. Q., Yan, B. B., Hsieh, J. H., Lau, S. P., Sun, X. W., Tay, B. K. (2002) Improving diamond–metal adhesion with graded TiCN interlayers. Journal of Applied Physics, 91 (4). 2051-2054 doi:10.1063/1.1434546
Plain TextSun, Chang Q., Fu, Y. Q., Yan, B. B., Hsieh, J. H., Lau, S. P., Sun, X. W., Tay, B. K. (2002) Improving diamond–metal adhesion with graded TiCN interlayers. Journal of Applied Physics, 91 (4). 2051-2054 doi:10.1063/1.1434546
In(2002, February) Journal of Applied Physics Vol. 91 (4) AIP Publishing

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