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Misják, F., Nagy, K. H., Lobotka, P., Radnóczi, G. (2014) Electron scattering mechanisms in Cu-Mn films for interconnect applications. Journal of Applied Physics, 116 (8). 83507pp. doi:10.1063/1.4893718

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Reference TypeJournal (article/letter/editorial)
TitleElectron scattering mechanisms in Cu-Mn films for interconnect applications
JournalJournal of Applied Physics
AuthorsMisják, F.Author
Nagy, K. H.Author
Lobotka, P.Author
Radnóczi, G.Author
Year2014 (August 28)Volume116
Issue8
PublisherAIP Publishing
DOIdoi:10.1063/1.4893718Search in ResearchGate
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Mindat Ref. ID5200329Long-form Identifiermindat:1:5:5200329:5
GUID0
Full ReferenceMisják, F., Nagy, K. H., Lobotka, P., Radnóczi, G. (2014) Electron scattering mechanisms in Cu-Mn films for interconnect applications. Journal of Applied Physics, 116 (8). 83507pp. doi:10.1063/1.4893718
Plain TextMisják, F., Nagy, K. H., Lobotka, P., Radnóczi, G. (2014) Electron scattering mechanisms in Cu-Mn films for interconnect applications. Journal of Applied Physics, 116 (8). 83507pp. doi:10.1063/1.4893718
In(2014, August) Journal of Applied Physics Vol. 116 (8) AIP Publishing

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