Reference Type | Journal (article/letter/editorial) |
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Title | Effect of interlayer on interfacial thermal transport and hot electron cooling in metal-dielectric systems: An electron-phonon coupling perspective |
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Journal | Journal of Applied Physics |
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Authors | Wang, Yan | Author |
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Lu, Zexi | Author |
Roy, Ajit K. | Author |
Ruan, Xiulin | Author |
Year | 2016 (February 14) | Volume | 119 |
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Issue | 6 |
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Publisher | AIP Publishing |
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DOI | doi:10.1063/1.4941347Search in ResearchGate |
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| Generate Citation Formats |
Mindat Ref. ID | 5204875 | Long-form Identifier | mindat:1:5:5204875:7 |
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GUID | 0 |
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Full Reference | Wang, Yan, Lu, Zexi, Roy, Ajit K., Ruan, Xiulin (2016) Effect of interlayer on interfacial thermal transport and hot electron cooling in metal-dielectric systems: An electron-phonon coupling perspective. Journal of Applied Physics, 119 (6). 65103pp. doi:10.1063/1.4941347 |
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Plain Text | Wang, Yan, Lu, Zexi, Roy, Ajit K., Ruan, Xiulin (2016) Effect of interlayer on interfacial thermal transport and hot electron cooling in metal-dielectric systems: An electron-phonon coupling perspective. Journal of Applied Physics, 119 (6). 65103pp. doi:10.1063/1.4941347 |
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In | (2016, February) Journal of Applied Physics Vol. 119 (6) AIP Publishing |
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