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Wei, Zhiyong, Yang, Ze, Liu, Ming, Wu, Honglei, Chen, Yunfei, Yang, Fan (2020) Thermal boundary conductance between high thermal conductivity boron arsenide and silicon. Journal of Applied Physics, 127 (5). 55105pp. doi:10.1063/1.5139669

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Reference TypeJournal (article/letter/editorial)
TitleThermal boundary conductance between high thermal conductivity boron arsenide and silicon
JournalJournal of Applied Physics
AuthorsWei, ZhiyongAuthor
Yang, ZeAuthor
Liu, MingAuthor
Wu, HongleiAuthor
Chen, YunfeiAuthor
Yang, FanAuthor
Year2020 (February 7)Volume127
Issue5
PublisherAIP Publishing
DOIdoi:10.1063/1.5139669Search in ResearchGate
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Mindat Ref. ID5213099Long-form Identifiermindat:1:5:5213099:7
GUID0
Full ReferenceWei, Zhiyong, Yang, Ze, Liu, Ming, Wu, Honglei, Chen, Yunfei, Yang, Fan (2020) Thermal boundary conductance between high thermal conductivity boron arsenide and silicon. Journal of Applied Physics, 127 (5). 55105pp. doi:10.1063/1.5139669
Plain TextWei, Zhiyong, Yang, Ze, Liu, Ming, Wu, Honglei, Chen, Yunfei, Yang, Fan (2020) Thermal boundary conductance between high thermal conductivity boron arsenide and silicon. Journal of Applied Physics, 127 (5). 55105pp. doi:10.1063/1.5139669
In(2020, February) Journal of Applied Physics Vol. 127 (5) AIP Publishing

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